Electronic device with metal frame antenna

ABSTRACT

An electronic device is provided. The electronic device includes a housing and a connection part. The housing includes a first housing portion that includes a first side face, and a second housing portion that includes a second side face. The connection part connects the first housing portion and the second housing portion. A first conductive member extends along at least a portion of the first side face, a first non-conductive member is disposed on the first side face, a second conductive member extends along at least a portion of the second side face, a second non-conductive member is disposed on the second side face, and when the second housing portion faces the first housing portion, the first non-conductive member and the second non-conductive member are substantially aligned.

PRIORITY

This application is a Continuation Application of U.S. patentapplication Ser. No. 16/126,534, which was filed with the U.S. Patentand Trademark Office on Sep. 10, 2018, which is a ContinuationApplication of U.S. patent application Ser. No. 15/351,161, which wasfiled with the U.S. Patent and Trademark Office on Nov. 14, 2016, nowU.S. Pat. No. 10,075,569, issued Sep. 11, 2018, and claims priorityunder 35 U.S.C. § 119(a) to Korean Patent Application No.10-2015-0159787, which was filed in the Korean Intellectual PropertyOffice on Nov. 13, 2015, the content of each of which is incorporatedherein by reference.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates generally to an electronic device inwhich an exterior metal frame operates as an antenna radiator.

2. Description of the Related Art

An electronic device having a communication function may provide amobile communication service using an antenna. The antenna may bearranged in a partial region of the inside and/or the outside of ahousing of the electronic device. The antenna may be formed as a patternof a printed circuit board, may be arranged on a carrier as a platetype, and may be formed on a flexible printed circuit board to bepositioned within the housing.

As another method, the antenna may use a metallic mechanical product asa radiator, or there may be a bezel-antenna or the like that uses themetallic housing as a radiator.

An antenna may be positioned inside an electronic device, and anexterior housing may be formed of a metal frame. A signal transmitted tothe outside from the antenna arranged inside the electronic device maybe at least partially distorted or blocked by a metal frame, which maycause the radiating performance of the antenna to be deteriorated.

The internal space of the housing of the electronic device, in which anantenna is to be mounted, may be limited, and when the electronic deviceis miniaturized, the internal space may be further limited.

In addition, when frequency bands to be supported by an antenna arediversified, the internal space of the housing may be further limitedbecause of the necessity to arrange a plurality of antennas or toarrange an antenna having a complicated form.

SUMMARY

The present disclosure has been made to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below.

Accordingly, an aspect of the present disclosure is to improve radiationperformance of an antenna by aligning a non-conductive member formed onan exterior of a first housing portion of an electronic device with anon-conductive member formed on an exterior of a second housing portionof the electronic device and using conductive member of the exterior ofthe electronic device as the antenna.

In accordance with an aspect of the present disclosure, a foldableelectronic device is provided that includes a foldable display and afoldable housing accommodating the flexible display, with the foldablehousing including a first housing part having two opposite sides, thefirst housing part including a first edge portion, the first edgeportion including two conductive portions and a first non-conductiveportion disposed between the two conductive portions of the first edgeportion; and a second housing part having two opposite sides, the secondhousing part including a second edge portion, the second edge portionincluding two conductive portions and a second non-conductive portiondisposed between the two conductive portions of the second edge portion,with the foldable housing being configured such that the firstnon-conductive portion and the second non-conductive portion aredisposed to be in alignment with each other when the foldable housing isfully folded, with a first conductive portion of the two conductiveportions of the first edge portion being electrically connected tocommunication circuitry such that a radio frequency communication signalis transmitted or received via the first conductive portion of the firstedge portion, and with a first portion of the flexible display beingaccommodated in the first housing part, and a second portion of theflexible display being accommodated in the second housing part.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram of an electronic device within a networkenvironment, according to an embodiment of the present disclosure;

FIG. 2 is a block diagram of a configuration of an electronic device,according to an embodiment of the present disclosure;

FIGS. 3A and 3B illustrate an electronic device, according to anembodiment of the present disclosure;

FIGS. 3C to 3E illustrate configurations of an antenna provided in ametal frame of an electronic device, according to various embodiments ofthe present disclosure;

FIGS. 4A to 4D illustrate a folder-type electronic device, according toan embodiment of the present disclosure;

FIGS. 5A and 5B illustrate a folder-type electronic device, according toan embodiment of the present disclosure;

FIGS. 6A and 6B a distribution of electric fields generated from anelectronic device according to an embodiment of the present disclosure;

FIG. 7 is a graph representing radiation efficiencies of an electronicdevice in various frequency bands, according to an embodiment of thepresent disclosure;

FIG. 8 illustrates a folder-type electronic device, according to anembodiment of the present disclosure;

FIGS. 9A and 9B illustrate a folder-type electronic device, according toan embodiment of the present disclosure;

FIGS. 10A and 10B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 11A and 11B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 12A and 12B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 13A and 13B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 14A and 14B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 15A and 15B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 16A and 16B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure;

FIG. 17 illustrates a folder-type electronic device, according to anembodiment of the present disclosure;

FIG. 18 illustrates a folder-type electronic device, according to anembodiment of the present disclosure;

FIG. 19 illustrates a folder-type electronic device, according to anembodiment of the present disclosure;

FIG. 20 illustrates a folder-type electronic device, according to anembodiment of the present disclosure;

FIGS. 21A to 21C illustrate a sliding-type electronic device, accordingto an embodiment of the present disclosure;

FIGS. 22A to 22C illustrate a flexible electronic device, according toan embodiment of the present disclosure;

FIGS. 23A and 23B illustrate an exterior cover-type electronic device,according to an embodiment of the present disclosure; and

FIG. 24 illustrates a state in which an electronic device is docked,according to an embodiment of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PRESENT DISCLOSURE

Hereinafter, embodiments of the present disclosure will be described inconnection with the accompanying drawings. The present disclosure mayhave various embodiments, and modifications and changes may be madetherein. Therefore, the present disclosure will be described in detailwith reference to particular embodiments shown in the accompanyingdrawings. However, it should be understood that the present disclosureis not limited to the particular embodiments, but includes allmodifications, equivalents, and/or alternatives within the spirit andscope of the present disclosure. In the description of the drawings,similar reference numerals may be used to designate similar elements.

Herein, the expressions “include”, “may include” and other conjugatesrefer to the existence of a corresponding disclosed function, operation,or constituent element, and do not limit one or more additionalfunctions, operations, or constituent elements. Further, “have”, andtheir conjugates merely denote a certain feature, numeral, step,operation, element, component, or a combination thereof, and do notexclude the existence or possibility of addition of one or more otherfeatures, numerals, steps, operations, elements, components, orcombinations thereof.

The expression “or” or “at least one of A or/and B” includes any or allof combinations of words listed together. For example, the expression “Aor B” or “at least A or/and B” may include A, may include B, or mayinclude both A and B.

In the present disclosure, expressions including ordinal numbers, suchas “first” and “second,” etc., may modify various elements. However,such elements are not limited by the above expressions. For example, theabove expressions do not limit the sequence and/or importance of theelements. The above expressions are used merely for the purpose ofdistinguishing an element from the other elements. For example, a firstuser device and a second user device indicate different user devicesalthough both of them are user devices. Accordingly, a first element maybe referred to as a second element, and likewise a second element mayalso be referred to as a first element, without departing from the scopeof embodiments of the present disclosure.

When an element is referred to as being “coupled” or “connected” to anyother element, it should be understood that not only may the element becoupled or connected directly to the other element, but also a thirdelement may be interposed therebetween. Contrarily, when an element isreferred to as being “directly coupled” or “directly connected” to anyother element, it should be understood that no other element isinterposed between the two elements.

The terms herein are used merely to describe one or more certainembodiments and are not intended to limit the present disclosure. Asused herein, singular forms may include plural forms as well, unless thecontext explicitly indicates otherwise. Further, all terms used herein,including technical and scientific terms, have the same meaning ascommonly understood by those of skill in the art to which the presentdisclosure pertains. Such terms as those defined in a generally useddictionary are to be interpreted to have the same meanings as thecontextual meanings in the relevant field of art, and are not to beinterpreted to have ideal or excessively formal meanings unless clearlydefined in herein.

An electronic device according to the present disclosure may be a deviceincluding a communication function. For example, the electronic devicemay include at least one of a Smartphone, a tablet personal computer(PC), a mobile phone, a video phone, an electronic book (e-book) reader,a desktop PC, a laptop PC, a netbook computer, a personal digitalassistant (PDA), a portable multimedia player (PMP), an MP3 player, amobile medical appliance, a camera, and a wearable device (e.g. ahead-mounted-device, such as electronic glasses, electronic clothes, anelectronic bracelet, an electronic necklace, an electronic appcessory,electronic tattoos, or a smartwatch).

The electronic device may also be a smart home appliance with acommunication function such as a television, a digital versatile disk(MID) player, an audio, a refrigerator, an air conditioner, a vacuumcleaner, an oven, a microwave oven, a washing machine, an air cleaner, aset-top box, a TV box (e.g., Samsung HomeSync™, Apple TV™, or GoogleTV™), a game console, an electronic dictionary, an electronic key, acamcorder, and an electronic photo frame.

The electronic device may also include at least one of various medicalappliances (e.g., magnetic resonance angiography (MRA), magneticresonance imaging (MRI), computed tomography (CT), and ultrasonicmachines), navigation equipment, a global positioning system (GPS)receiver, an event data recorder (EDR), a flight data recorder (FDR),automotive infotainment device, electronic equipment for ships (e.g.,ship navigation equipment and a gyrocompass), avionics, securityequipment, a vehicle head unit, an industrial or home robot, anautomatic teller machine (ATM), and a point of sale (POS) device.

The electronic device may also include at least one of a part offurniture or a building/structure, an electronic board, an electronicsignature receiving device, a projector, and various kinds of measuringinstruments (e.g., a water meter, an electric meter, a gas meter, and aradio wave meter).

Further, the electronic device may be a flexible device.

The electronic device may also be a combination of one or more of theaforementioned various devices. Further, it will be apparent to thoseskilled in the art that the electronic device, according to the presentdisclosure, is not limited to the aforementioned devices.

Herein, the term “user” in may indicate a person who uses an electronicdevice or a device (e.g., an artificial intelligence electronic device)that uses an electronic device.

FIG. 1 is a block diagram of an electronic device within a networkenvironment, according to an embodiment of the present disclosure.

Referring to FIG. 1, an electronic device 101 is provided in a networkenvironment. The electronic device 101 includes at least one of a bus110, a processor 120, a memory 130, an input/output interface 150, adisplay 160, and a communication interface 170. At least one of thecomponents of the electronic device 101 may be omitted, or othercomponents may be additionally included in the electronic device 101.

The bus 110 is a circuit that interconnects the aforementionedcomponents of the electronic device 101 and transmits communicationsignals (e.g., control messages) between the components.

The processor 120 carries out operations or data processing related tocontrol and/or communication of at least one other component (forexample, the memory 130, the input/output interface 150, the display160, or the communication interface 170) of the electronic device 101.

The memory 130 stores commands or data (e.g., a reference pattern or areference touch area) associated with one or more other components ofthe electronic device 101. The memory 130 stores software and/or aprogram 140. For example, the program 140 includes a kernel 141, amiddleware 143, an application programming interface (API) 145, anapplication program 147, with one or more of the kernel 141, themiddleware 143, and the API 145 being referred to as an Operating System(OS).

The kernel 141 controls or manages system resources (e.g., the bus 110,the processor 120, or the memory 130) used for performing an operationor function implemented by the other programs (e.g., the middleware 143,the API 145, or the application program 147). Further, the kernel 141provides an interface through which the middleware 143, the API 145, orthe application program 147 may access the individual elements of theelectronic device 101 to control or manage the system resources.

The middleware 143 functions as an intermediary for allowing the API 145or the application program 147 to communicate with the kernel 141 toexchange data. In addition, the middleware 143 processes one or moretask requests received from the application program 147 according topriorities thereof. For example, the middleware 143 assigns prioritiesfor using the system resources (e.g., the bus 110, the processor 120, orthe memory 130) of the electronic device 101, to at least oneapplication of the application program 147. For example, the middleware143 performs scheduling or loading balancing on the one or more taskrequests by processing the one or more task requests according to thepriorities assigned thereto.

The API 145 is an interface through which the application 147 controlsfunctions provided from the kernel 141 or the middleware 143, and mayinclude at least one interface or function (e.g., instruction) for filecontrol, window control, image processing, or text control.

The input/output interface 150 forwards instructions or data input froma user through an input/output device (e.g., various sensors, such as anacceleration sensor or a gyro sensor, and/or a device such as a keyboardor a touch screen), to the processor 120, the memory 130, or thecommunication interface 170 through the bus 110. For example, theinput/output interface 150 provides the processor 120 with data on auser' touch entered on a touch screen. Further, the input/outputinterface 150 outputs instructions or data, received from the processor120, the memory 130, or the communication interface 170 via the bus 110,through an output unit (e.g., a speaker or the display 160).

The display 160 includes, for example, a liquid crystal display (LCD), alight emitting diode (LED) display, an organic LED (OLED) display, amicro electro mechanical system (MEMS) display, an electronic paperdisplay, etc. The display 160 displays various types of content (e.g., atext, images, videos, icons, symbols, etc.) for the user. The display160 may include a touch screen and receive a touch input, a gestureinput, a proximity input, a hovering input, etc., using an electronicpen or a user's body part. The display 160 may display a web page.

The communication interface 170 sets communication between theelectronic device 101 and a first external electronic device 102, asecond external electronic device 104, or a server 106. For example, thecommunication interface 170 connects to a network 162 through wirelessor wired communication to communicate with the second externalelectronic device 104 or the server 106.

The wireless communication may use at least one of, for example, longterm evolution (LTE), LTE-advance (LTE-A), code division multiple access(CDMA), wideband CDMA (CDMA), universal mobile telecommunications system(UMTS), wireless broadband (WiBro), and global system for mobilecommunications (GSM), as a cellular communication protocol. In addition,the wireless communication may include a short range communication 164.The short-range communication 164 may include at least one of Wi-Fi,Bluetooth™ (BT), near field communication (NFC), and GPS.

Each of the first external electronic device 102 and the second externalelectronic device 104 may be a device which is the same as or differentfrom the electronic device 101.

The server 106 may include a group of one or more servers.

According to the present disclosure, all or a part of operationsperformed in the electronic device 101 can be performed in anotherelectronic device or multiple electronic devices (e.g., the firstexternal electronic device 102 or the second external electronic device104 or the server 106). In this case, when the electronic device 101should perform some functions or services automatically or by a request,the electronic device 101 may make a request for performing at leastsome functions related to the functions or services by the firstexternal electronic device 102, the second external electronic device104, or the server 106, instead of performing the functions or servicesby itself. The first external electronic device 102, the second externalelectronic device 104, or the server 106 may perform a functionrequested from the electronic device 101 or an additional function andtransfer the performed result to the electronic device 101. Theelectronic device 101 can provide the requested function or service toanother electronic device by processing the received result as it is oradditionally. To this end, for example, cloud computing, distributedcomputing, or client-server computing technology may be used.

FIG. 2 is a block diagram of a configuration of an electronic device,according to an embodiment of the present disclosure.

Referring to FIG. 2, an electronic device 201 is provided. Theelectronic device 201 may constitute the entirety or a part of theelectronic device 101 illustrated in FIG. 1, or may expand all or someelements of the electronic device 101. The electronic device 201includes an application processor (AP) 210, a communication module 220,a subscriber identification module (SIM) card 224, a memory 230, asensor module 240, an input device 250, a display 260, an interface 270,an audio module 280, a camera module 291, a power management module 295,a battery 296, an indicator 297, and a motor 298.

The AP 210 runs an operating system or an application program to controla plurality of hardware or software elements connected to the AP 210,and may perform processing and operation of various data includingmultimedia data. The AP 210 may be implemented as a system on chip(SoC). The AP 210 may further include a graphical processing unit (GPU).The AP 210 may further include at least one of other elements of theelectronic device 210 (e.g., the cellular module 221). The AP 210 loadsan instruction or data, which is received from a non-volatile memoryconnected to each or at least one of other elements, to a volatilememory and processes the loaded instruction or data. In addition, the AP210 stores in the non-volatile memory, data received from at least oneof the other elements or generated by at least one of the otherelements.

The communication module 220 performs data transmission/reception incommunication between the electronic device 201 and other electronicdevices connected through a network. The communication module 220includes a cellular module 221, a Wi-Fi module 223, a BT module 225, aUPS module 227, an NFC module 228, and a radio frequency (RE) module229.

The cellular module 221 provides a voice telephony, a video telephony, atext service, an Internet service, etc., through a telecommunicationnetwork (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro, GSM, etc.), Inaddition, the cellular module 221 may use the SIM card 224 to performelectronic device identification and authorization within thetelecommunication network. According to an embodiment of the presentdisclosure, the cellular module 221 may perform at least some offunctions that the AP 210 may provide. For example, the cellular module221 may perform at least one part of a multimedia control function.

The WiFi module 223, the BT module 225, the GPS module 227 and the NFCmodule 228 each may include a processor for processing datatransmitted/received through the corresponding module. According to anembodiment of the present disclosure, two or more of the cellular module221, the WiFi module 223, the BT module 225, the UPS module 227 and theNFC module 228 may be included within one IC or IC package.

The RF module 229 performs transmission/reception of an RF signal. TheRF module 229 may include a transceiver, a power amplifier module (PAM),a frequency filter, a low noise amplifier (LNA), an antenna, etc.According to an embodiment of the present disclosure, at least one ofthe cellular module 221, the WiFi module 223, the BT module 225, the GPSmodule 227 or the NFC module 228 may perform transmission/reception ofan RE signal through a separate RF module.

The SIM card 224 may be inserted into a slot provided in a specificposition of the electronic device 201. The SIM card 224 includes uniqueidentification information (e.g., an integrated circuit card ID (ICCID))or subscriber information (e.g., an international mobile subscriberidentity (IMSO).

The memory 230 includes an internal memory 232 or an external memory234. The internal memory 232 includes at least one of a volatile memory(e.g., a dynamic random access memory (DRAM), a static RAM (SRAM) and asynchronous DRAM (SDRAM)) or a non-volatile memory (e.g., a one-timeprogrammable read only memory (OTPROM), a programmable ROM (PROM), anerasable and programmable ROM (EPROM), an electrically erasable andprogrammable ROM (EEPROM), a mask ROM, a flash ROM, a not and (NAND)flash memory, and a not or (NOR) flash memory).

The internal memory 232 may be a solid state drive (SSD).

The external memory 234 may include a flash drive, for example, compactflash (CF), secure digital (SD), micro-SD, mini-SD, extreme digital(xD), a memory stick, etc. The external memory 234 may be operativelyconnected with the electronic device 201 through various interfaces.

The sensor module 240 measures a physical quantity or detects anactivation state of the electronic device 201, and converts measured ordetected information into an electric signal. The sensor module 240includes, at least one of a gesture sensor 240A, a gyro sensor 240B, anair pressure sensor 240C, a magnetic sensor 240D, an acceleration sensor240E, a grip sensor 240F, a proximity sensor 240G, a red, green, blue(RGB) sensor 240H, a biometric sensor 240I, a temperature/humiditysensor 240J, an light sensor 240K, and an ultraviolet (UV) sensor 240M.Additionally or alternatively, the sensor module 240 may also include anE-nose sensor, an electromyography (EMG) sensor, an electroencephalogram(EEG) sensor, an electrocardiogram (ECG) sensor, an infrared (IR)sensor, an iris sensor, a fingerprint sensor, etc. The sensor module 240may further include a control circuit for controlling at least one ormore sensors belonging therein.

The input device 250 includes a touch panel 252, a (digital) pen sensor254, a key 256, an ultrasonic input device 258, and the like.

The touch panel 252 may detect a touch input in at least one of acapacitive overlay scheme, a pressure sensitive scheme, an infrared beamscheme, and an acoustic wave scheme. The touch panel 252 may alsoinclude a control circuit. In the case of the capacitive overlay scheme,physical contact or proximity detection is possible. The touch panel 252may further include a tactile layer, to provide a tactile response to auser.

The (digital) pen sensor 254 may be implemented in the same or a similarmethod to receiving a user's touch input or by using a separate sheetfor detection.

The key 256 may include a physical button, an optical key, or a keypad.

The ultrasonic input device 258 is capable of identifying data bydetecting a sound wave in the electronic device 201 through an inputtool generating an ultrasonic signal, and enables wireless detection.

The electronic device 201 may also use the communication module 220 toreceive a user input from a connected external device (e.g., a computeror a server)

The display 260 includes a panel 262, a hologram device 264, or aprojector 266.

The panel 262 may be an LCD, an Active-Matrix Organic LED (AMOLED), etc.The panel 262 may be implemented to be flexible, transparent, orwearable. The panel 262 may be constructed as one module along with thetouch panel 252 as well.

The hologram device 264 may use interference of light to display athree-dimensional image in the air.

The projector 266 may project light to a screen to display an image. Thescreen may be located inside or outside the electronic device 201.

The display 260 may further include a control circuit for controllingthe panel 262, the hologram device 264, or the projector 266.

The interface 270 includes a high-definition multimedia interface (HDMI)272, a universal service bus (USB) 274, an optical interface 276, or aD-subminiature (D-sub) 278. Additionally or alternatively, the interface270 may include a mobile high-definition link (MHL) interface, an SDcard/multimedia card (MMC) interface or an infrared data association(IrDA) standard interface.

The audio module 280 converts a voice and an electric signalinteractively. The audio module 280 may process sound information whichis inputted or outputted through a speaker 282, a receiver 284, anearphone 286, the microphone 288, and the like.

The camera module 291 takes still pictures and moving pictures. Thecamera module 291 may include one or more image sensors (e.g., a frontsensor or a rear sensor), a lens, an image signal processor (ISP), or aflash (e.g., an LED or a xenon lamp).

The power management module 295 manages electric power of the electronicdevice 201. The power management module 295 may include a powermanagement integrated circuit (PMIC), a charger IC, a battery, a batterygauge, etc.

The PMIC may be mounted within an integrated circuit or an SoCsemiconductor. A charging scheme may be divided into a wired chargingscheme and a wireless charging scheme. The charger IC charges thebattery 296, and prevents the inflow of overvoltage or overcurrent froman electric charger. The charger IC includes a charger IC for at leastone of the wired charging scheme or the wireless charging scheme. Thewireless charging scheme may be a magnetic resonance scheme, a magneticinduction scheme, an electromagnetic wave scheme, etc. A supplementarycircuit for wireless charging a circuit, such as a coil loop, aresonance circuit, a rectifier, and the like, may be added.

The battery gauge may measure a level of the battery 296, a voltageduring charging, a current or a temperature. The battery 296 generatesor stores electricity, and uses the stored or generated electricity tosupply power to the electronic device 201. The battery 296 may include,for example, a rechargeable battery or a solar battery.

The indicator 297 displays a specific status of the electronic device201 or one part (e.g., the AP 210) thereof, for example, a bootingstate, a message state, a charging state, etc.

The motor 298 may convert an electric signal into a mechanicalvibration.

The electronic device 101 may include a processing device (e.g., a GPU)for mobile TV support. The processing device for mobile TV support mayprocess media data according to the standards of digital multimediabroadcasting (DMB), digital video broadcasting (DVB), a media flow, andthe like.

Each of the above-described elements of the electronic device mayinclude one or more components, and the name of a corresponding elementmay vary according to the type of electronic device. The electronicdevice according to the present disclosure may include at least one ofthe above-described elements and may exclude some of the elements orfurther include other additional elements. Further, some of the elementsof the electronic device according to the present disclosure may becoupled to form a single entity while performing the same functions asthose of the corresponding elements before the coupling.

FIGS. 3A and 3B illustrate an electronic device, according to anembodiment of the present disclosure.

Referring to FIGS. 3A and 3B, an electronic device 300 is shown. InFIGS. 3A and 3B, an orthogonal coordinate system is used in which the Yaxis represents a vertical direction of the electronic device 300, the Yaxis represents the horizontal direction of the electronic device 300,and the Z axis represents an up-and-down direction (thicknessdirection). In FIG. 3A, a perspective view of the electronic device 300is provided. In FIG. 3B, a front view of the electronic device 300 isprovided. The electronic device 300, according to various embodiments,may be the same as electronic devices 101 and 201 illustrated in FIGS. 1and 2.

In FIGS. 3A and 3B at least a portion of a housing of the electronicdevice 400 forms at least a portion of an antenna. For example, at leastone gap may be formed in a housing portion 310 of the electronic device300. The housing portion 310 may form the whole or at least a portion ofthe exterior of the electronic device 300. The housing portion 310 maybe formed of materials, such as a plastic, a metal, carbon fiber andother fiber composites, ceramics, glass, and wood, or combinationsthereof.

The entire housing portion 310 may be formed of one material or acombination of materials, and may be partially formed of materialshaving different physical properties.

The housing portion 310 of the electronic device 300 may have a topface, a bottom face, and a plurality of side faces. The top face, thebottom face, and the plurality of side faces of the housing portion 310may be formed of the same material, or of materials having differentphysical properties.

The housing portion 310 of the electronic device 300 may include adisplay 301 (the display 301 may be referred to as a “touch screen” whena touch panel is mounted) on the top face thereof.

A receiver 302 may be disposed above the display 301 so as to receive avoice of a counterpart. Components for conducting various functions ofthe electronic device 300 may be arranged around the receiver 302. Thecomponents may include one or more sensors 303, 304, and 305. Thesensors 303, 304, and 305 may include at least one of an illuminancesensor (e.g., an optical sensor), a proximity sensor (e.g., an opticalsensor), an infrared sensor, and an ultrasonic sensor. The front face ofthe housing portion 310 may additionally include at least one frontcamera 306.

The display 301 may be formed in a large size to occupy a greaterportion of the top face of the electronic device 300. A main home screenrefers to a first screen that is displayed on the display 301 when thepower source of the electronic device 300 is turned on. When theelectronic device 300 has several pages of different home screens, themain home screen may be the first home screen among the several pages ofhome screens. The home screen may display shortcut icons to executefrequently used applications, a main menu switching key, time, weather,or the like. The main menu switching key may cause the main screen to bedisplayed on the display 301. In the upper end of the display 301,status bars may be formed to indicate the statuses of the electronicdevice 300, such as a battery charge status, a received signal strength,and the current time. Below the display 301, a home key 307 a, a menukey 307 b, and a back key 307 c may be formed.

When the home key 307 a is pushed, the electronic device 300 may displaythe main home screen on the display 301. For example, when the home key307 a is touched in the state where a home screen, which is differentfrom the main home screen, or the menu screen is displayed on thedisplay 301, the main home screen may be displayed on the display 301.In another example, when the home key 307 a is touched whileapplications are executed on the display 301, the main home screen maybe displayed on the display 301. In another example, the home key 307 amay be used in order to cause the most recently used application or atask manager to be displayed on the display 301.

The menu button 307 b may provide a connection menu that may be used onthe display 301. For example, the connection menu may include a widgetaddition menu, a background screen change menu, a retrieve menu, anedition menu, and an environment setting menu. The back button 307 c maycause the screen, which was executed just prior to the currentlyexecuted screen, to be displayed, or may cause the most recently usedapplication to be terminated.

The housing portion 310 of the electronic device 300 may include ahousing portion that includes a first face, a second face that facesopposite to the first face, and a first side face that encloses at leasta portion of the space between the first and second faces. The housingportion 310 may include a conductive material and a non-conductivematerial.

The housing portion 310 may be a conductive member (e.g., a metallicmember), and at least a portion of the front face, at least a portion ofthe rear face, or at least a portion of the side face may be formed as aconductive member.

Alternatively, the housing portion 310 may be a non-conductive member(e.g., a non-conductive housing), and at least a portion of the frontface, at least a portion of the rear face, or at least a portion of theside face of the housing portion 310 may be formed as a non-conductivemember.

For example, when the housing portion 310 of the electronic device 300is a metallic housing, the metallic housing may include an exteriorconductive member that forms the exterior of the metallic housing.

The exterior conductive member may include metal frames arranged alongthe rim of the electronic device 300. For example, the metal frame maybe arranged to extend to at least a partial region of the rear face ofthe electronic device 300 in which the rim extends.

The conductive member may form at least a partial region of the rim ofthe electronic device 300, and the non-conductive member may form theremaining portion of the rim. In such a case, the housing may be formedin a manner in which the non-conductive member is formed on theconductive member through insert injection molding.

A conductive rim structure, which forms the rim of the housing of theelectronic device 300, may include a plurality of conductive members 321to 324. The conductive members 321 to 324 are metal frames that form atleast a portion of the exterior, and because the electronic device 300has a substantially rectangular shape in a plan view, the metal framesmay include first to fourth metal frames. For example, the conductivemembers 321 to 324 may form a polygonal shape without being limited tothe substantially rectangular shape, and may form a curved shape (e.g.,a circular shape or an oval shape).

The housing portion 310 may include first to fourth sides. The firstside and the second side, which are opposite to each other, may have thesame length, the third side and the fourth side, which are opposite toeach other, may have the same length, and the third and fourth sides maybe configured to be longer than the first and second sides. Hereinafter,a conductive member will be referred to as a metal frame.

When viewing the electronic device 300 from the front side, the metalframe positioned at the top side of the housing of the electronic device300 may be referred to as a first metal frame 321, the metal framepositioned at the bottom side of the housing of the electronic device300 may be referred to as a second metal frame 322, the metal framepositioned at the left side of the housing of the electronic device 300may be referred to as a third metal frame 323, and the metal framepositioned at the right side of the housing of the electronic device 300may be referred to as a fourth metal frame 324.

The first metal frame 321 or the second metal frame 322 may include atleast one non-conductive member. For example, the first metal frame 321and the second metal frame 322 may include non-conductive members 331and 332 and non-conductive members 333 and 334, respectively. Each ofthe non-conductive members 331, 332, 333, and 334 is made of aninsulation material, and may thus be referred to as an insulationportion. Further, each of the non-conductive members 331, 332, 333, and334 splits adjacent metal frames and may thus be referred to as a splitportion.

The non-conductive members may be arranged in the first metal frame 321,in the second metal frame 322. or in both of the first metal frame 321and the second metal frame 322. For example, a pair of non-conductivemembers 331 and 332 respectively disposed at the opposite ends of thefirst metal frame 321 may be defined as first non-conductive members,and a pair of non-conductive members 333 and 334 respectively disposedat the opposite ends of the second metal frame 322 may be defined assecond non-conductive members.

At least a portion of a metal frame split by at least one non-conductivemember may operate as at least a portion of an antenna radiator, Forexample, at least a portion of each of the metal frames 321 to 324 splitby the first non-conductive members 331 and 332 and the secondnon-conductive members 333 and 334 may be used as an antenna radiator.For example, the first metal frame 321 may be a top center radiator thatis provided by a pair of first non-conductive members 331 and 332 formedat a predetermined interval, and the second metal frame 332 may be abottom center radiator that is provided by a pair of secondnon-conductive members 333 and 334 formed at a predetermined interval.At least one of the first non-conductive members 331 and 332 or thesecond non-conductive members 333 and 334 may be formed when anon-conductive member is formed on a metal frame through insertinjection molding.

When one of the first metal frame 321 and the second metal frame 322 isfed with power to operate as at least a portion of an antenna radiator,one of the third metal frame 323 and the fourth metal frame 324 iselectrically coupled to at least one of the first metal frame 321 andthe second metal frame 322 to operate as at least a portion of anantenna radiator.

The pair of first non-conductive members 331 and 332 may be formed by atleast partially filling one or more gaps between the metal frames with anon-conductive material. The pair of second non-conductive members 333and 334 may be formed by filling a gap between the metal frames with anon-conductive material. The first non-conductive members 331 and 332and the second non-conductive members 333 and 334 may be arranged to bevertically symmetric or asymmetric and/or horizontally symmetric orasymmetric with reference to the display.

The first metal frame 321 may further include top side metal frames 323a and 324 a that respectively extend from the third and fourth metalframes 323 and 324, and are then bent. For example, the firstnon-conductive members 331 and 332 may be arranged between the firstmetal frame 321 and the top side metal frames 323 a and 324 a,respectively. The first metal frame 321 may operate as an antennaradiator that is fed with power from a power feeding circuit so as toform resonance. When the first metal frame 321 is fed with power fromthe power feeding circuit to operate as an antenna radiator, at least aportion of the top side metal frame 323 a and the third metal frame 323and at least a portion of the top side metal frame 324 a and the fourthmetal frame 324 are electrically coupled to each other so as to operateas a portion of the antenna radiator.

The second metal frame 322 may further include bottom side metal frames323 b and 324 b that respectively extend from the third and fourth metalframes 323 and 324, and are then bent. For example, the bottom sidemetal frames 323 b and 324 b may be formed by extending from the thirdand fourth frames 323 and 324, respectively, and being bent at a rightangle. The second non-conductive members 333 and 334 may be arrangedbetween the second metal frame 322 and the bottom side metal frames 323b and 324 b, respectively. The second metal frame 322 may operate as anantenna radiator that is fed with power from a power feeding circuit soas to form resonance. When the second metal frame 322 is fed with powerfrom the power feeding circuit to operate as an antenna radiator, atleast a portion of the bottom side metal frame 323 b and the third metalframe 323 and at least a portion of the bottom side metal frame 324 band the fourth metal frame 324 are electrically coupled to each other soas to operate as a portion of the antenna radiator.

At least some of various electronic components may be arranged on thefirst metal frame 321 of the electronic device 300. For example, in thefirst metal frame 321, at least one of a socket device for inserting acard-type external device or a memory card for expanding a storage spacemay be accommodated. An earphone jack connector configured to connect anearphone jack may be disposed on the first metal frame 321. However, thearrangement of the socket device or the memory card is not limitedthereto.

On the second metal frame 322, an interface connector port 308 may bedisposed in order to perform a transmission/reception function by anexternal device as well as to charge the electronic device 300 byreceiving power applied from an external power source. For example, anearphone jack hole may be disposed at one side of the interfaceconnector port 308. However, without being limited thereto, at least oneof the above-mentioned electronic components may be disposed outside themetal frame.

At least one side key button may be disposed on the third metal frame323 to perform a volume up/down function, a scroll function, etc.

At least one second side key button 309 may be disposed on the fourthmetal frame 324 The second side key buttons 309 may serve to perform apower ON/OFF function, an electronic device wake-up/sleep function, etc.

At least one key button may be disposed in at least a partial region,other than the display 301, in the front face of the electronic device300. The key button may perform a home key button function. Afingerprint recognition sensor device may be disposed on the top surfaceof the home key button. The home key button may be configured to performa first function (e.g., the home screen return function or thewake-up/sleep function) by an operation of physically pressing the homekey button, and to perform a second function (e.g., a fingerprintrecognition function) by an operation of swiping the top surface of thehome key button.

The display 301 of the electronic device 300 may be configured to have aflat surface or a curved surface at one side or at each side. Thedisplay may include a curved face portion having a curvature. The curvedface portion may extend along an edge region of the display and alongthe X axis and/or the Y axis. The electronic device 300 may selectivelydisplay at least a portion of information by controlling a displaymodule.

FIGS. 3C to 3E illustrate configurations of an antenna provided in ametal frame of an electronic device, according to various embodiments ofthe present disclosure.

Referring to FIG. 3C, the electronic device 300 is shown. The firstmetal frame 321 (i.e., a conductive member) disposed on the housingportion 310 of the electronic device 300, according to variousembodiments, may operate as at least a portion of an antenna radiatorthat is fed with power from the communication circuit 380 so as to formresonance. For example, at least one of the metal frames 321; 323, 323 a; 324, 324 a, which are respectively split by the non-conductive members331 and 332, may operate as at least a portion of an antenna radiator.For example, the first metal frame 321 may operate as at least a portionof a main antenna radiator, and each of the side metal frames 323 and323 a disposed at one side of the first metal frame 321 and/or the sidemetal frames 324 and 324 a disposed at the other side of the first metalframe 321 may operate as at least a portion of an auxiliary antennaradiator by each being electrically coupled to the first metal frame321. Each of the side metal frames 323, 323 a ; 324, 324 a may bereferred to as a coupling antenna or a coupling radiator.

The first metal frame 321 may be fed with power by a power feeding unit390 disposed on a circuit board so as to operate as at least a portionof an antenna radiator. In such a case, the conductive member 321 mayserve as a main antenna of the electronic device 300. The otherconductive members 323 and 324, in the vicinity of the conductive member321, may not be electrically connected to the communication circuit 380.

As another example, the other conductive members 323 and 324 in thevicinity of the conductive member 321 may be electrically connected toeach of the ground members 371 and 372 of the circuit board 370 or otherground members 373 and 374. Each of the ground members 371 to 374 may beformed as a ground plane in at least a partial region of the circuitboard 370.

The communication circuit 380 may be formed in at least a portion of thecircuit board 370, which exists within the electronic device 300. Thecircuit board 370 may generally refer to all the boards that may beconventionally mounted within the electronic device 300 (such as aprinted circuit board (PCB), a flexible printed circuit board (FPCB),and printed board assembly (PBA)).

The electronic device 300 may differently adjust the length of anantenna depending on a bandwidth to be supported. For example, theantenna bandwidth may be differently adjusted depending on the positionof a non-conductive member, the position of a power feeding unit, anopening (i.e., a gap or split portion), and a ground unit.

At least one antenna may be formed in the electronic device 300 by usinga metal frame. The antenna may be configured by using a single bandantenna structure and/or a multi-band antenna structure. An ordinaryantenna used in a portable electronic device has a planar inverted-Fantenna (PIFA) or monopole radiator as a basic structure, and the numberof the antennas may be determined depending on a service frequency, aservice bandwidth, and a kind of the service. Although frequencies aredifferent depending on the region of the world, typically a low band of700 MHz to 900 MHz, a mid-band of 1700 MHz to 2100 MHz, and a high bandof 2300 MHz to 2700 MHz are used as major communication bands, andvarious wireless communication services, such as BT, GPS, and WIFI maybe additionally used. Service bands, which are similar to each other interms of frequency bands, are lumped with each other and are designed tobe split to several antennas.

For example, a main antenna, which is in charge of voice/datacommunication (e.g., GPRS, WCDMA, or LTE), which is the principalcommunication of an electronic device, is positioned in a lower end ofthe electronic device where the number of metal components thatundermine an antenna performance is small, and in view of Europeanstandards, the following bands should he implemented: 24 bands in totalshould be implemented including 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1,B2, B5, B8), and LTE (B1, B2, B3, B4, B5, B7, B8, B12, B17, B18, B19,B20, B26, B38, B39, B40, B41).

The electronic device 300 may lump service bands, of which the frequencybands are similar to each other over at least two regions, with eachother so as to implement antennas. As an example, 2G (GSM850, EGSM, DCS,PCS), WCDMA (B1, B2, B5, B8) and LTE (B1, B2, B3, B4, B5, B8, B12, B17,B18, B19, B20, B26, B may be implemented in Main 1 antenna, and anantenna for LTE (B7, 38, 40, 41) may be designed in Main 2 antenna.

Referring to FIG. 3D, an electronic device 3100 is shown. The electronicdevice 3100 may be the same as the electronic device 101 of FIG. 1.

The electronic device 3100, according to various embodiments, mayinclude at least one gap in a side face, and a non-conductive memberthat fills at least a portion of the at least one gap. For example, theelectronic device 3100 may include non-conductive members 3133 and 3134,which are respectively disposed in at least partial regions of third andfourth metal frames 3123 and 3124, which are located at opposite sidesof the housing portion, respectively.

The first and second non-conductive members 331 and 332, illustrated inFIG. 3C, are disposed in the metal frames that are disposed in the upperend, lower end, or upper and lower ends of the housing portion of theelectronic device, and the first and second non-conductive members 3133and 3134, illustrated in FIG. 3D, are disposed on side faces of thehousing portion of the electronic device 3100, and may include, forexample, a first non-conductive member 3133 disposed on the first sideface and a second non-conductive member 3134 disposed on the second sideface.

The metal frame 3121 disposed around the upper end of the electronicdevice 3100 may operate as at least a portion of an antenna radiator bybeing fed with power from the communication circuit 3180. For example,each of the metal frames 3121, 3123, and 3124, which are respectivelysplit by the non-conductive members 3133 and 3134, may operate as atleast a portion of an antenna radiator. The first metal frame 3121 mayoperate as a main antenna radiator, and the first side metal frame 3123disposed at one side of the first metal frame 3121 and/or the side metalframe 3124 disposed at the other side of the first metal frame 3121 mayoperate as an auxiliary antenna radiator by being electrically coupledto the first metal frame 3121. At least one side metal frame 3123 or3124 may be referred to as a coupling antenna or a coupling radiator.

The first metal frame 3121 is fed with power by the power feeding unit3190 formed on the circuit board 3170 to operate as a main antennaradiator such that the first metal frame 3121 may serve as the mainantenna of the electronic device 3100. The other conductive members 3123and 3124 in the vicinity of the conductive member 3121 may be or may notbe electrically connected to the communication circuit 3180.

As another example, the other conductive members 3123 and 3124 in thevicinity of the first metal frame 3121 may be electrically connected toeach of the ground members 3172 and 3173 of the circuit board 3170. Eachof the ground members 3172 and 3171 may be formed as a ground plane inat least a partial region of the circuit board 3170.

The communication circuit 3180 may be formed in at least a portion ofthe circuit board 3170, which exists within the electronic device 3100.The circuit board 3170 may generally refer to all the boards that may beconventionally mounted within the electronic device 3100, such as a PCB,a FPCB, and PBA.

The electronic device 3100 may differently adjust the length of anantenna depending on a bandwidth to be supported. For example, theantenna bandwidth may be differently adjusted depending on the distancebetween a power feeding unit and a ground unit.

Referring to FIG. 3E, an electronic device 3200 is shown. The electronicdevice 3200 may be the same as the electronic device 101 of FIG. 1.

The electronic device 3200, according to various embodiments, mayinclude an additional ground line 3273 on the metal frame 3221, ascompared with the electronic device 3100 illustrated in FIG. 3D. Theelectronic device 3200 may be electrically connected, via the additionalground line 3273, to a ground member 3274 disposed on the board 3270.

The electronic device 3200 has the same configuration as the electronicdevice 3100 illustrated in FIG. 3D, except that the additional groundline 3273 and the ground member 3274 are configured. Accordingly, theremaining descriptions will be omitted.

FIGS. 4A to 4D illustrate a folder-type electronic device, according toan embodiment of the present disclosure.

Referring to FIGS. 4A to 4D, a folder-type electronic device 400 isshown. In FIGS. 4A and 4B, perspective views of the electronic device400 in a folded and unfolded state, respectively, are provided. In FIG.4C, a side view of the electronic device 400 in the folded state isprovided. In FIG. 4D, a front view of the electronic device 40( )in theunfolded state is provided. The electronic device 400, according tovarious embodiments, may be the same as electronic devices 101 and 201of FIGS. 1 and 2.

In FIGS. 4A to 4D, at least a portion of a housing of the electronicdevice 400 forms at least a portion of an antenna. For example, at leastone gap may be formed in a first housing portion 410 or a second housingportion 420 of the electronic device 400.

The first housing portion 410 may be referred to as a first electronicdevice, and the second housing portion 420 may be referred to as asecond electronic device. The electronic device 400 may further includea connection part 430. The connection part 430 may interconnect thefirst and second housing portions 410 and 420 to be rotatable about arotation axis A, and may be defined as a hinge unit. For example, thehinge unit 430 may provide a pivot movement between the first and secondhousing portions 410 and 420. For example, the second housing portion420 may be oriented to face the first housing portion 410, and may befolded or unfolded around the rotation axis A. The first and secondhousing portions 410 and 420 may form the whole or at least a portion ofthe exterior of the electronic device. According to various embodiments,the first and second housing portions 410 and 420 may be formed ofmaterials, such as a plastic, a metal, carbon fiber and/or other fibercomposites, ceramics, glass, and wood, or combinations thereof.

The first and second housing portions 410 and 420 may have first andsecond rim structures, respectively. For example, the first and secondrim structures are made of a conductive material, and may be referred toas first and second conductive rim structures.

The first conductive rim structure of the first housing portion 410 mayhave a substantially rectangular shape that includes a first side, asecond side that is shorter than the first side, a third side that hasthe same length as the first side, and a fourth side that has the samelength as the second side. The second conductive rim structure of thesecond housing portion 420 may have a substantially rectangular shapethat includes a first side, a second side that is shorter than the firstside, a third side that has the same length as the first side, and afourth side that has the same length as the second side.

When the electronic device 400 is in the folded state, the first andsecond housing portions 410 and 420 may be arranged such that the rimsthereof overlap with each other in a shape where the first and secondhousing portions 410 and 420 are substantially aligned to each other.The first side of the first housing portion 410 may have the same lengthas the first side of the second housing portion 420, and the remainingsides of the first and second housing portions 410 and 420 may be equalto each other.

Each of the first and second housings 410 and 420 may have a top face, abottom face, and a plurality of side faces. The top face, the bottomface, and the plurality of side faces of the first housing 410 may beformed of materials having the same physical property, or may be formedof materials having different physical properties. For example, the topface, the bottom face, and the plurality of side faces of the secondhousing 420 may be formed of the same material, or may be formed ofmaterials having different physical properties.

The electronic device 400 may have one or more displays on each of thefirst housing portion 410 and the second housing portion 420. Forexample, the first housing portion 410 may include a first display 401disposed on the top face thereof. The first display 401 may be a touchscreen. The second housing portion 420 may include a second display 403disposed on the top face (i.e., an outer face) thereof. The seconddisplay 403 may be a touch screen. The second housing portion 420 mayinclude a third display 402 disposed on the bottom face (i.e., an innerface) thereof. The third display 402 may be a touch screen. The firsthousing portion 410 may be provided with a keyboard operated by aphysical pushing operation instead of the first display 401. The one ormore displays of the electronic device may be formed in different sizes.For example, the third display 403 may be configured to be smaller thanthe first and second displays 401 and 402, and may not be disposed.

The first housing portion 410 of the electronic device 400 may include adisplay 401 mounted on the top face thereof (i.e., the first display 401may be referred to as a “touch screen” when a touch panel is mounted).The first display 401 may be formed in a large size to occupy a greaterportion of the top face of the electronic device 400. The first display401 may be the same as the display 301 illustrated in FIGS. 3A and 3B.

The first housing portion 410 of the electronic device 400 may include afirst face, a second face that faces opposite to the first face, and afirst side face that encloses at least a portion of the space betweenthe first and second faces. The first housing portion 410 may include aconductive material and a non-conductive material. For example, thefirst housing portion 410 may have an exterior rim structure thatincludes a conductive member and a non-conductive member.

In the first housing portion 410, at least a portion of the front face,at least a portion of the rear face, or at least a portion of the sideface may be formed of a conductive material. In the first housingportion 410, at least a portion of the front face, at least a portion ofthe rear face, or at least a portion of the side face may be formed of anon-conductive material. For example, in the case where the firsthousing portion 410 of the electronic device 400 is a metallic housing,the metallic housing may include an exterior conductive member thatforms the exterior of the metallic housing. The exterior conductivemember may include a metal frame arranged along the rim of theelectronic device 400.

The metal member may be arranged on at least a partial region of the rimof the electronic device 400, and the remaining portion may be replacedby a non-conductive member. In such a case, the first housing portion410 may be formed in a manner in which the non-conductive member isformed on the metal frame through insert injection molding.

The rim of the first housing portion 410 of the electronic device 400may include a plurality of metal frames (i.e., metal portions). Themetal frames may include first to fourth metal frames 411 to 414.

The metal frame positioned at the bottom side of the first housingportion 410 may be referred to as a first metal frame 411, the metalframe positioned at the top side of the first housing portion 410 may bereferred to as a second metal frame 412, the metal frame positioned atthe left side of the first housing portion 410 may be referred to as athird metal frame 413, and the metal frame positioned at the right sideof the first housing portion 410 may be referred to as a fourth metalframe 414.

The first metal frame 411 may include one or more non-conductive members415 and 416. Each of the non-conductive members 415 and 416 is made of anon-conductive material, and may thus be referred to as an insulationportion. Further, each of the non-conductive members 415 and 416 splitsadjacent metal frames and may thus be referred to as a split portion.For example, one or more non-conductive members may be aligned along theconductive member or the side face of the housing portion. Thenon-conductive member may include a non-metallic portion. Thenon-conductive members 415 and 416 may include a metallic material. Theconductive member may include a metallic material. The metallic materialmay include any one of aluminum, stainless steel, and amorphous metalalloy.

The amorphous metal alloy may have a fine structure similar to a liquidphase in which no crystal structure exists because atoms are irregularlyarranged, unlike a conventional alloy. Because the amorphous metal alloyhas a homogeneous isotropic characteristic, and does not have acrystallographic anisotropy, the amorphous metal alloy may be excellentin mechanical strength, and because the amorphous metal alloy is uniformin structure and composition, the amorphous metal alloy has excellentcorrosion resistance.

Each of the metal frames, which are split by respective non-conductivemembers 415 and 416 may be used as an antenna radiator. The first metalframe 411 may be a top center radiator that is provided by a pair of thenon-conductive members 415 and 416 formed at a predetermined interval.For example, the non-conductive members 415 and 416 may be formed when anon-conductive member is formed on the first metal frame 411 throughinsert injection molding.

When the first metal frame 411 is fed with power to operate as anantenna radiator, at least a portion of each of the third and fourthmetal frames 413 and 414 may be electrically coupled to the first metalframe 411 to operate as at least a portion of an antenna radiator. Thethird and fourth metal frames 413 and 414 may be arranged in the form ofbeing split by a non-conductive material.

The non-conductive members 415 and 416 may be formed by filling a gapbetween the metal frames with a non-conductive material.

The first metal frame 411 may further include top side metal frames 413a and 414 a that respectively extend from the third and fourth metalframes 413 and 414, and are then bent. The non-conductive members 415and 416 may be arranged between the first metal frame 411 and the topside metal frames 413 a and 414 a, respectively.

The first metal frame 411 may operate as an antenna radiator that is fedwith power from a power feeding circuit so as to form resonance. Whenthe first metal frame 411 is fed with power from the power feedingcircuit to operate as an antenna radiator that forms resonance, at leasta portion of the top side metal frame 413 a and the third metal frame413 or at least a portion of the top side metal frame 414 a and thefourth metal frame 414 are electrically coupled to each other so as tooperate as at least a portion of the antenna radiator.

The first housing portion 410 of the electronic device 400 may include acommunication circuit and a ground unit disposed on a board therein. Theconfiguration, in which the center metal frame is connected to acommunication circuit and a ground unit to operate as an antennaradiator that forms resonance, was described above with reference toFIG. 3C, and thus, duplicate descriptions will be omitted.

The second housing portion 420 may include a second display 402 on thebottom face thereof (i.e., the display 402 may be referred to as a“touch screen” when a touch panel is mounted). The second display 402may be formed in a large size to occupy a greater portion of the bottomface of the electronic device 400. The second housing portion 420 mayinclude a third display 403 on the top face thereof (i.e., the display403 may be referred to as a “touch screen” when a touch panel ismounted).

The second housing portion 420 of the electronic device 400 may includea first face, a second face that faces opposite to the first face, and afirst side face that encloses at least a portion of the space betweenthe first and second faces. The second housing portion 420 may include aconductive material and a non-conductive material.

The second housing portion 420 may be made of a conductive member (e.g.,a metal housing), and at least a portion of the front face, at least aportion of the rear face, or at least a portion of the side face of thesecond housing portion 420 may be made of a conductive material.Alternatively, the second housing portion 420 may be made of anon-conductive member (e.g., a non-conductive housing), and at least aportion of the front face, at least a portion of the rear face, or atleast a portion of the side face of the second housing portion 420 maybe made of a non-conductive material. For example, in the case where thesecond housing portion 420 of the electronic device 400 is a metallichousing, the metallic housing may include an exterior conductive memberthat forms the exterior of the metallic housing. The exterior conductivemember may include a metal frame arranged along the rim of theelectronic device 400.

The rim of the second housing portion 420 of the electronic device 400may include a plurality of metal frames. The metal frames may includefirst to fourth metal frames 421 to 424.

The metal frame positioned at the bottom side of the second housingportion 420 may be referred to as a first metal frame 421, the metalframe positioned at the top side of the second housing portion 420 maybe referred to as a second metal frame 422, the metal frame positionedat the left side of the second housing portion 420 may be referred to asa third metal frame 423, and the metal frame positioned at the tightside of the second housing portion 420 may be referred to as a fourthmetal frame 424.

When the electronic device 400 is in the folded state as shown in FIG.4A, an electric field, which is generated from the first metal frame(i.e., a conductive member) 411 disposed in the first housing portion410 and is formed in a region adjacent to the non-conductive members(i.e., insulation portions) 415 and 416, may be formed in a region otherthan the direction of the second housing portion 420, which may causethe antenna radiating performance to be deteriorated. For example, whenthe direction of an electric field is restricted to some extent, theradiation performance of the antenna is poor. Accordingly, when theelectronic device 400 is of a folder-type and a non-conductive member isdisposed only in the first housing portion, the antenna radiationperformance may be deteriorated when the electronic device 400 is in astandby state (i.e., a folded state).

FIGS. 5A and 5B illustrate a folder-type electronic device, according toan embodiment of the present disclosure.

Referring to FIGS. 5A and 5B, a folder-type electronic device 500 isshown. in FIGS. 5A and 5B, perspective views of the electronic device500 in a folded and unfolded state, respectively, are provided. Theelectronic device 500, according to various embodiments, may be the sameas the electronic device 101 of FIG. 1.

In FIGS. 5A and 5B, at least a portion of a housing of the electronicdevice 500 forms at least a portion of an antenna. For example, at leastone gap may be formed in a first housing portion 510 or a second housingportion 520 of the electronic device 500.

The electronic device 500 according to various embodiments is differentfrom the electronic device illustrated in FIGS. 4A to 4D only in theconfiguration of the second housing portion 520. The configurations ofthe remaining components first housing portion 510 and a connection part530 are the same as those of the electronic device illustrated in FIGS.4A to 4D). Thus, descriptions of the first housing portion 510 and theconnection part 530 will be omitted. The second housing portion 520 ofthe electronic device 500 may include a second display 502 on the innerface thereof (i.e., the second display 502 may be referred to as a“touch screen” when a touch panel is mounted). For example, the seconddisplay 502 may be formed in a large size to occupy a greater portion ofthe inner face of the electronic device 500. The second housing portion520 of the electronic device 500 may include a third display 503 mountedon the outer face thereof (i.e., the third display 503 may be referredto as a “touch screen” when a touch panel is mounted). The third display503 may be formed to occupy a portion of the outer face of theelectronic device 500.

The second housing portion 520 of the electronic device 500 may includea first face, a second face that faces opposite to the first face, and afirst side face that encloses at least a portion of the space betweenthe first and second faces. The second housing portion 520 may include aconductive material and/or a non-conductive material.

The second housing portion 520 may be made of a conductive member (e.g.,a metal housing), and at least a portion of the front face, at least aportion of the rear face, or at least a portion of the side face of thesecond housing portion 520 may be made of a conductive material. Thesecond housing portion 520 may be made of a non-conductive member (e.g.,a non-conductive housing), and at least a portion of the front face, atleast a portion of the rear face, or at least a portion of the side faceof the second housing portion 520 may be made of a non-conductivematerial. For example, in the case where the second housing portion 520of the electronic device 500 is a metallic housing, the metallic housingmay include an exterior conductive member that forms the exterior of themetallic housing. The exterior conductive member may include at leastone metal frame arranged along the rim of the electronic device 500. Themetal member may be arranged only on at least a partial region of therim of the electronic device 500, and the remaining portion may bereplaced by a non-conductive member. In such a case, the second housingportion 520 may be formed in a manner in which the non-conductive memberis formed on the metal frame through insert injection molding.

The rim of the second housing portion 520 of the electronic device 500may include one or more metal frames. The metal frames may include firstto fourth metal frames 521 to 524.

The metal frame positioned at the bottom side of the second housingportion 520 may be referred to as a first metal frame 521, the metalframe positioned at the top side of the second housing portion 520 maybe referred to as a second metal frame 522, the metal frame positionedat the left side of the second housing portion 520 may be referred to asa third metal frame 523, and the metal frame positioned at the rightside of the second housing portion 520 may be referred to as a fourthmetal frame 524.

The first metal frame 521 may include one or more non-conductive members525 and 526. Each of the non-conductive members 525 and 526 is made ofan insulation material, and may thus be referred to as an insulationportion. Further, each of the non-conductive members 525 and 526 splitsadjacent metal frames and may thus be referred to as a split portion.

Each of the metal frames, which are split by respective non-conductivemembers 525 and 526, may be used as an antenna radiator. The first metalframe 521 may be a top center frame that is provided by a pair of thenon-conductive members 525 and 526 formed at a predetermined interval.For example, the non-conductive members 525 and 526 may be formed when anon-conductive member is formed on the first metal frame 521 throughinsert injection molding.

When the first metal frame 521 is fed with power by a power feedingcircuit to operate as an antenna radiator, at least a portion of each ofthe third and fourth metal frames 523 and 524 may be electricallycoupled to the first metal frame 521 to operate as at least a portion ofan antenna radiator. The third and fourth metal frames 523 and 524 maybe arranged in the form of being split by a non-conductive material (notillustrated).

The non-conductive members 525 and 526 may be formed by filling a gap(i.e., an opening) between the metal frames with a non-conductivematerial.

The first metal frame 521 may further include top side metal frames 523a and 524 a that respectively extend from the third and fourth metalframes 523 and 524, and are then bent. The first non-conductive members525 and 526 may be arranged between the first metal frame 521 and thetop side metal frames 523 a and 524 a, respectively. The first metalframe 521 may operate as an antenna radiator that is fed with power froma power feeding circuit so as to form resonance. When the first metalframe 521 is fed with power from the power feeding circuit to operate asan antenna radiator, at least a portion of the top side metal frame 523a and the third metal frame 523 or at least a portion of the top sidemetal frame 524 a and the fourth metal frame 524 is electrically coupledto each other so as to operate as a portion of the antenna radiator.

The second housing portion 520 of the electronic device 500 may includetherein a communication circuit and a ground unit disposed on a board.The configuration, in which the first metal frame 521 is connected to acommunication circuit and a ground unit to operate as at least a portionof an antenna radiator that forms resonance, was described above withreference to FIG. 3C, therefore, duplicate descriptions will be omitted.

An antenna using the metal frames of the electronic device 500 accordingto various embodiments is a call transmission/reception antenna, and maybe any one of a CDMA antenna, a personal communication service (PCS)antenna, and a GSM antenna. However, the present disclosure is notlimited thereto.

As another example, an antenna using the metal frame of the electronicdevice 500 may be variously used as long as it is an antenna thattransmits/receives electromagnetic waves wirelessly like a GPS antenna,a Bluetooth antenna, or a wireless LAN antenna.

The electronic device 500 may differently adjust the length of anantenna depending on a bandwidth to be supported. For example, theantenna bandwidth may be differently adjusted depending on the positionsof a non-conductive member, a power feeding unit, and a ground unit.

In the electronic device 500, the first non-conductive members 515 and516 and the second non-conductive members 525 and 526 may be arranged tobe substantially symmetrically aligned to each other when viewed withreference to the YZ, plane. For example, the first non-conductivemembers 515 and 516 and the second non-conductive members 525 and 526may be substantially aligned in the vertical direction with reference tothe Z axis.

The conductive member (i.e., a center metal frame) 511 of the firsthousing portion 510 and the conductive member (i.e., a center metalframe) 521 of the second housing 520 may be arranged along the Z axis tobe symmetric to each other.

With this arrangement, the electronic device 500 may maintain theradiation effect of the antenna even in the state where the firsthousing portion 510 and the second housing portion 520 are disposedclose to each other (i.e., when the electronic device 500 is in a foldedstate).

For example, when the second housing portion 520 is disposed close tothe first housing portion 510 (i.e. when the first and secondnon-conductive members are symmetrically aligned), radiation radiatedfrom the antenna radiator formed by at least a portion of the firsthousing portion 510 may be radiated through the second non-conductivemember (i.e., opening) of the second housing portion 520.

When the first face of the first housing portion 510 and the first faceof the second housing portion 520 of the electronic device 500 face eachother, the first non-conductive members 515 and 516 and the secondnon-conductive members 525 and 526 are substantially aligned so thatantenna radiation may be executed through the open region of the antennaformed in the first housing portion 510 and an open region of the secondhousing portion 520 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing520, the deterioration of the antenna radiation performance can beprevented.

FIGS. 6A and 6B illustrate a distribution of electric fields generatedfrom at an electronic device, according to an embodiment of the presentdisclosure.

Referring to FIGS. 6A and 6B, an electronic device 600 is shown. Theelectronic device 600, according to various embodiments, may be the sameas the electronic device 101 of FIG. 1.

The electronic device 600 includes first non-conductive members 615 and616 of a first housing portion 610. Many electric fields may be formedin the vicinity of the first non-conductive members 615 and 616.

A second housing portion 620 may include second non-conductive members625 and 626, which are located at the positions corresponding to thefirst non-conductive members 615 and 616. A passage may be formed,through which the electric fields generated in the vicinity of the firstnon-conductive members 615 and 616 may be radiated toward the secondhousing portion 620, so that many electric fields may also be formed inthe vicinity of the second non-conductive members 625 and 626.

The electric fields may be generated in a shape that encompasses thewhole of the first housing portion 610 and the second housing portion620. As shown in FIGS. 6A and 6B, many electric fields are also formedtoward the second housing portion 620.

The electronic device 600 may be provided with second non-conductivemembers 625 and 626 in the second housing portion 620 so as to maintainthe radiation direction of the energy fields generated from the firstnon-conductive members 615 and 616, and the first conductive member 611and the second conductive member 621, which are centrally positioned,may be electrically coupled to each other so as to maintain a betterradiation performance.

FIG. 7 is a graph representing radiation efficiencies of an electronicdevice in various frequency bands, according to an embodiment of thepresent disclosure.

Referring to FIG. 7 the graph illustrates radiation efficiencies forvarious frequency bands (low band, mid band, and high band) in a casewhere a non-conductive member exists in a second housing portion 520 ofthe electronic device 500 and a case where a non-conductive member doesnot exist in the second housing portion 520 of the electronic device500. That is, the graph illustrates a case where first split portions(e.g., the positions, each of which has an opening shape, and where thefirst non-conductive members 515 and 516 are located) are disposed inthe first housing portion 510, and second split portions (e.g., thepositions, each of which has an opening shape, and where the secondnon-conductive members 525 and 526 aligned with the first non-conductivemembers are located) exist (e.g., the electronic device 500 in thefolded state, as in FIG. 5A), and in a case where first split portions(e.g., the positions, each of which has an opening shape, and where thefirst non-conductive members 515 and 516 are located), and second splitportions (e.g., the positions, each of which has an opening shape, andwhere the second non-conductive members 525 and 526 aligned with thefirst non-conductive members are located) do not exist (e.g., theelectronic device 400 in the folded state, as in FIG. 4A). The low bandmay be in the range of about 800 MHz to 1000 MHz, the mid band may be inthe range of about 1700 MHz to 2200 MHz, and the high band may be in therange of 2300 MHz to 2700 MHz.

As shown in FIG. 7, the antenna employed in the electronic device 500exhibits a higher total radiation efficiency for respective frequencybands in the case where the split portions corresponding to the firstsplit portions exist in the second housing portion 520 (the upper curvein the graph) (e.g., the electronic device in the folded state as inFIG. 5A) as compared to that in the case where the second split portionsdo not exist in the second housing portion 520 (the lower curve in thegraph) (e.g., the electronic device in the folded state as in FIG. 4A).

Table 1, shows a comparison of the radiation efficiency for respectivefrequency bands when the second split portions (e.g., the non-conductivemembers 525 and 526) corresponding to the first split portions (e.g.,the first non-conductive members 515 and 516) of the first housingportion 510 exist in the second housing portion 520 and the radiationefficiency in the case where the second split portions do not exist inthe second housing portion 520.

TABLE 1 Band (MHz) 850 900 1800 1900 2100 2^(nd) Split  2.75% 6.97%9.91% 14.6% 12.8% portion (−15.6 dB) (−11.6 dB)   (−10 dB) (−8.36 dB)(−8.93 dB) does not exist 2^(nd) Split 20.4% 22.7% 24.1% 27.4% 20.3%portion  (−6.9 dB) (−6.44 dB) (−6.19 dB) (−5.63 dB) (−6.93 dB) existsDifference 8.7 dB 5.16 dB 3.81 dB 2.73 dB 2 dB

Referring to Table 1, the antenna employed in the electronic device,according to various embodiments, may be greatly improved in radiationperformance when the second split portions exist in the second housingportion 520, as compared to the case where no second split portionexists.

Referring to Table 1, various embodiments exhibit a great difference inradiation performance in the low band (850 to 900 MHz). In the low band(850 to 900 MHz), it can be seen that the radiation efficiency isimproved three or more times in the level of 5.16 dB to 8.7 dB.

For example, in the 850 MHz band, which is the low band, the radiationefficiency in the case where no second split portion exists in thesecond housing portion 520 (e.g., the electronic device in the foldedstate as in FIG. 4A) is 14.6% while the radiation efficiency in the casewhere the second split portions exist in the second housing portion 520(e.g., the electronic device in the folded state as in FIG. 5A) isimproved to 20.4%.

According to another example, in the 900 MHz band, which is the lowband, the radiation efficiency in the case where no second split portionexists in the second housing portion 520 (e.g., the electronic device inthe folded state as in FIG. 4A) is 6.97% while the radiation efficiencyin the case where the second split portions exist in the second housingportion 520 (e.g., the electronic device in the folded state as in FIG.5A) is improved to 22.7%.

In the 1900 MHz band, which is the mid band, the radiation efficiency inthe case where no second split portion exists in the second housingportion 520 (e.g., the electronic device in the folded state as in FIG.4A) is 2.75% while the radiation efficiency in the case where the secondsplit portions exist in the second housing portion 520 (e.g., theelectronic device in the folded state as in FIG. 5A) is improved to27.4%.

In addition, in the 2000 MHz band, which is the mid band, the radiationefficiency in the case where no second split portion exists in thesecond housing portion 520 (the electronic device in the folded state asin FIG. 4A) is 12.8% while the radiation efficiency in the case wherethe second split portions exist in the second housing portion 520 (theelectronic device in the folded state as in FIG. 5A) is improved to20.3%.

In addition, in the 2500 MHz band, which is the high band, the radiationefficiency can be improved in the case where the second split portionsexist in the second housing portion 520 (e.g., the electronic device inthe folded state as in FIG. 5A) as compared to the case where no secondsplit portion exists in the second housing portion 520 (the electronicdevice in the folded state as in FIG. 4A).

FIG. 8 illustrates a folder-type electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 8, a perspective view of a folder-type electronicdevice 800 in a folded state is shown. The electronic device 800,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIG. 8, at least one gap may be formed in a first housing portion 810and/or a second housing portion 820 of the electronic device 800.

The first and second housing portions 810 and 820 of the electronicdevice 800 may be rotatably connected to each other by a connection part830. According to various embodiments, each of the first and secondhousing portions 810 and 820 may include a conductive member and/or anon-conductive member. For example, in the electronic device 800, thefirst and second housing portions 810 and 820 may include one or moremetal frames 811 and 821 disposed along the rims thereof, respectively.

The electronic device 800 may include at least one non-conductive memberthat is formed. in a region adjacent to the connection part 830 thatinterconnects the first housing portion 810 and the second housingportion 820. For example, the electronic device 800 may include firstnon-conductive members 815 and 816 and second non-conductive members 825and 826, which may be respectively disposed in the first and secondmetal frames 811 and 821 of the first and second housing portions 810and 820 in which the connection part 830 is disposed.

Each of the first and second metal frames 811 and 821, which are splitby each of the first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826, may be used as an antenna radiator.The first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826 may be formed by filling gaps (i.e.,openings) between the first and second metal frames with anon-conductive material.

In the folded/unfolded state of the electronic device 800, the firstnon-conductive members 815 and 816 and the second non-conductive members825 and 826 may be respectively disposed in the first metal frame 811and the second metal frame 821 positioned around the connection part830. The first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826 may be disposed at the opposite sidesof the connection part 830, respectively.

The connection part 830 may be referred to as a hinge unit because itprovides a rotation axis of the first and second housing portions 810and 820. The connection part 830 may include at least one hinge arm, anda hinge cam, a hinge shaft, a hinge spring, and so on, which are knownin the art, may be disposed inside the hinge arm.

The first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826 may be aligned to each other, and thefirst and second metal frames 811 and 821 may be aligned to each other.For example, the first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826 may be arranged to be verticallysymmetric to each other with reference to the connection part 830, andthe first metal frame 811 and the second metal frame 812 may be arrangedto be vertically symmetric to each other with reference to theconnection part 830.

When the first face of the first housing portion 810 and the first faceof the second housing portion 820 of the electronic device 800 face eachother, the first non-conductive members 815 and 816 and the secondnon-conductive members 825 and 826 are substantially aligned so thatantenna radiation may be executed through the open region of the antennaformed in the first housing portion 810 and an open region of the secondhousing portion 820 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing820, deterioration of the antenna radiation performance can beprevented.

The electronic device 800 is not limited to an arrangement in which thefirst non-conductive members 815 and 816 and the second non-conductivemembers 825 and 826 are disposed around the connection part 830.Instead, each of the first non-conductive members 815 and 816 and thesecond non-conductive members 825 and 826 may be disposed in a symmetricor asymmetric arrangement on the metal frames disposed in at least theremaining portion, other than a portion where the connection part 830 isdisposed, in each of the first and second housing portions 810 and 820.

FIGS. 9A and 9B illustrate a folder-type electronic device, according toan embodiment of the present disclosure.

Referring to FIGS. 9A and 9B, a folder-type electronic device 900 isshown. in FIGS. 9A and 9B, perspective views of the electronic device900 in a folded and unfolded state, respectively, are provided. Theelectronic device 900, according to various embodiments, may be the sameas the electronic device 101 of FIG. 1.

In FIGS. 9A and 9B, at least a portion of a housing of the electronicdevice 900 forms at least a portion of an antenna. For example, at leastone gap may be formed in a first housing portion 910 and/or a secondhousing portion 920 of the electronic device 900.

The electronic device 900 may include one or more non-conductivemembers, are disposed on the first housing portion 910 and the secondhousing portion 920, respectively. Non-conductive members may bearranged in the first housing portion 910 and the second housing portion920, respectively, such that the number of non-conductive members in thefirst housing portion 910 may be different from the number ofnon-conductive members in the second housing portion 920. Non-conductivemembers may be asymmetrically arranged in the first housing portion 910and the second housing portion 920, respectively, and the number ofnon-conductive members arranged in the first housing portion 910 may bedifferent from the number of non-conductive members arranged in thesecond housing portion 920.

For example, first non-conductive members 915 and 916 may be disposed inthe first housing portion 910 and a second non-conductive member 925 maybe disposed in the second housing portion 920. One non-conductive member915 disposed in the first housing portion 910 and the secondnon-conductive member 925 disposed in the second housing portion 920 maybe arranged to be aligned to each other. The non-conductive membersdisposed in the electronic device 900 may be arranged not only in theregions of the first and second metal frames 911 and 921 of the firstand second housing portions 910 and 920, but also in the second metalframes 912 and 922, the third metal frames 913 and 923, or the fourthmetal frames 914 and 924 of the first and second housing portions as thesame arrangement structures.

The electronic device 900 is different from the electronic deviceillustrated in FIGS. 4A to 4D only in the configuration of the secondhousing portion 920. The configurations of the remaining components(i.e., the first housing portion 910 and a connection part 930 are thesame as those of the electronic device illustrated in FIGS. 4A to 4D).Thus, descriptions of the first housing portion 910 and the connectionpart 930 will be omitted.

The rim of the second housing portion 920 of the electronic device 900may include a plurality of metal frames (i.e., conductive portions). Themetal frames may include first to fourth metal frames 921 to 924depending on the disposed positions thereof.

The first housing portion 910 and the second housing portion 920 of theelectronic device 900 may include non-conductive members, in which thenumber of the non-conductive members disposed in the first housingportion 910 may be different from the number of the non-conductivemembers disposed in the second housing portion 920. For example, thefirst metal frame 921 of the second housing portion 920 may include thesecond non-conductive member 925. Each of the metal frames 921 and 923,which are split by the first non-conductive member 925, may be used asat least a portion of an antenna radiator. The second non-conductivemember 925 may be disposed at a side of the first metal frame 921. Forexample, in the state illustrated in FIG. 9A, the first non-conductivemembers 915 and 916, and the second non-conductive member 925 may bearranged asymmetrically in the vertical direction and in the horizontaldirection. For example, in the state where the first and second housingportions 910 and 920 of the electronic device are folded, thenon-conductive member 915 of the first housing portion and the secondnon-conductive member 925 of the second housing portion may be arrangedto be superimposed one on another, which may improve an antennaradiation efficiency.

The second non-conductive member 925 may be formed by filling a gap(i.e., an opening) between the metal frames 921 and 923 with anon-conductive material.

The electronic device 900 may differently adjust the length of anantenna depending on a bandwidth to support. For example, the antennabandwidth may be differently adjusted depending on the positions of anon-conductive member (i.e., the opening or gap), a power feeding unit,and a ground unit.

When the first face of the first housing portion 910 and the first faceof the second housing portion 920 of the electronic device 900 face eachother, the non-conductive member 915 and the second non-conductivemember 925 are substantially aligned so that antenna radiation may beexecuted through the open region of the antenna formed in the firsthousing portion 910 and an open region of the second housing portion 920substantially aligned thereto. Thus, when the antenna radiation isexecuted to the open region of the second housing 920, the deteriorationof the antenna radiation performance can be prevented.

FIGS. 10A and 10B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 10A and 10B, a folder-type electronic device 1000 isshown. In FIGS. 10A and 10B, perspective views of the electronic device1000 in a folded and unfolded state, respectively, are provided. Theelectronic device 1000, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 10A and 10B, at least a portion of a housing of the electronicdevice 1000 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1010 or a secondhousing portion 1020 of the electronic device 1000.

The electronic device 1000 may include one or more non-conductivemembers, which are disposed on the first housing portion 1010 and thesecond housing portion 1020, respectively. Non-conductive members may bearranged in the first housing portion 1010 and the second housingportion 1020, respectively, and the number of non-conductive membersarranged in the first housing portion 1010 may be different from thenumber of non-conductive members arranged in the second housing portion1020. Non-conductive members may be asymmetrically arranged in the firsthousing portion 1010 and the second housing portion 1020, respectively,and the number of non-conductive members arranged in the first housingportion 1010 may be different from the number of non-conductive membersarranged in the second housing portion 1020.

For example, a first non-conductive member 1015 may be disposed in thefirst housing portion 1010 and two or more second non-conductive members1025 and 1026 may be disposed in the second housing portion 1020. Thefirst non-conductive member 1015 disposed in the first housing portion1010 and one second non-conductive member 1025 disposed in the secondhousing portion 1020 may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 1000 may bearranged not only in the regions of the first and second metal frames1011 and 1021 of the first and second housing portions 1010 and 1020,but also in the second metal frames 1012 and 1022, the third metalframes 1013 and 1023, or the fourth metal frames 1014 and 1024 of thefirst and second housing portions as the same arrangement structures.

The electronic device 1000 is different from the electronic deviceillustrated in FIGS. 4A to 4D only in the configuration of the firsthousing portion 1010. The configurations of the remaining components(i.e., the second housing portion 1020 and a connection part 1030 arethe same as those of the electronic device illustrated in FIGS. 4A to4D). Thus, descriptions of the second housing portion 1020 and theconnection part 1030 will be omitted. The rim of the first housingportion 1010 of the electronic device 1000 may include a plurality ofmetal frames (i.e., conductive portions). The metal frames may includefirst to fourth metal frames 1011 to 1014 depending on the disposedpositions thereof.

The first metal frame 1011 may include the first non-conductive member1015. Each of the metal frames 1011 and 1013, which are split by thefirst non-conductive member 1015, may be used as an antenna radiator.The first non-conductive member 1015 may be disposed at a side of thefirst metal frame 1011. For example, in the state illustrated in FIG.10A, the first non-conductive members 1015, and the secondnon-conductive members 1025 and 1026 may be arranged asymmetrically inthe vertical direction and in the horizontal direction. In the statewhere the first and second housing portions 1010 and 1020 of theelectronic device 1000 are folded, the first non-conductive member 1015of the first housing portion and the second non-conductive member 1025of the second housing portion may be arranged to be superimposed one onanother, which may improve an antenna radiation efficiency.

The first non-conductive member 1015 may be formed by filling a gap(i.e., an opening) between the metal frames 1011 and 1013 with anon-conductive material.

The electronic device 1000 may differently adjust the length of anantenna depending on a bandwidth to support. For example, the antennabandwidth may be differently adjusted depending on the positions of asplit portion (i.e., the opening or gap), a non-conductive member, apower feeding unit, and a ground unit.

When the first face of the first housing portion 1010 and the first faceof the second housing portion 1020 of the electronic device 1000 faceeach other, the first non-conductive member 1015 and the secondnon-conductive member 1025 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1010 and an open region of the secondhousing portion 1020 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1020, the deterioration of the antenna radiation performance can beprevented.

FIGS. 11A and 11B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 11A and 11B, a folder-type electronic device 1100 isshown. In FIGS. 11A and 11B, perspective views of the electronic device1100 in a folded and unfolded state, respectively, are provided. Theelectronic device 1100, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 11A and 11B, at least a portion of a housing of the electronicdevice 1100 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1110 and/or asecond housing portion 1120 of the electronic device 1100.

The electronic device 1100 may include one non-conductive member, whichis disposed in each of the first housing portion 1110 and the secondhousing portion 1120. Non-conductive members may be arranged in thefirst housing portion 1110 and the second housing portion 1120,respectively, and the number of non-conductive members arranged in thefirst housing portion 1110 may be the same as the number ofnon-conductive members arranged in the second housing portion 1120.Non-conductive members may be symmetrically arranged in the firsthousing portion 1110 and the second housing portion 1120, respectively,and the number of non-conductive members arranged in the first housingportion 1110 may be the same as the number of non-conductive membersarranged in the second housing portion 1120.

For example, a first non-conductive member 1115 may be disposed in thefirst housing portion 1110 and a second non-conductive member 1125 maybe disposed in the second housing portion 1120. The first non-conductivemember 1115 disposed in the first housing portion 1110 and the secondnon-conductive member 1125 disposed in the second housing portion 1120may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 1100 may bearranged not only in the regions of the first and second metal frames1111 and 1121 of the first and second housing portions 1110 and 1120,but also in the second metal frames 1112 and 1122, the third metalframes 1113 and 1123, or the fourth metal frames 1114 and 1124 of thefirst and second housing portions as the same arrangement structures.

The electronic device 1100 may further include a connection part 1130.The configuration of both the first and second housing portions 1110 and1120 is the same as that of the first housing portion 910 illustrated inFIGS. 9A and 9B, and thus, detailed descriptions thereof will beomitted. The first metal frame 1111 of the first housing portion mayinclude a single non-conductive member 1115. Each of the metal frames1111 and 1113, which are split by the single non-conductive member 1115,may be used as an antenna radiator. The first non-conductive member 1115may be disposed at a side of the first metal frame 1111. The first metalframe 1121 of the second housing portion may include a singlenon-conductive member 1125. Each of the metal frames 1121 and 1123,which are split by the second non-conductive member 1125, may be used asan antenna radiator. The second non-conductive member 1125 may bedisposed at a side of the first metal frame 1121.

When the first face of the first housing portion 1110 and the first faceof the second housing portion 1120 of the electronic device 1100 faceeach other, the first non-conductive member 1115 and the secondnon-conductive member 1125 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1110 and an open region of the secondhousing portion 1120 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1120, the deterioration of the antenna radiation performance can beprevented.

In the state illustrated in FIG. 11A, the first and secondnon-conductive members 1115 and 1125 may be arranged symmetrically inthe vertical direction and symmetrically in the horizontal direction. Inthe state where the first and second housing portions 1110 and 1120 arefolded, each of the first and second non-conductive members 1115 and1125 may be disposed to be superimposed one on another, which mayimprove an antenna radiation efficiency.

FIGS. 12A and 12B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 12A and 12B, a folder-type electronic device 1200 isshown. In FIGS. 12A and 12B, perspective views of the electronic device1200 in a folded and unfolded state, respectively, are provided. Theelectronic device 1200, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 12A and 12B, at least a portion of a housing of the electronicdevice 1200 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1210 or a secondhousing portion 1220 of the electronic device 1200.

The electronic device 1200 may include one non-conductive member, whichis disposed in each of the first housing portion 1210 and the secondhousing portion 1220. Non-conductive members may be arranged in thefirst housing portion 1210 and the second housing portion 1220,respectively, and the number of non-conductive members arranged in thefirst housing portion 1210 may be the same as the number ofnon-conductive members arranged in the second housing portion 1220.Non-conductive members may be symmetrically arranged in the firsthousing portion 1210 and the second housing portion 1220, respectively,and the number of non-conductive members arranged in the first housingportion 1210 may be the same as the number of non-conductive membersarranged in the second housing portion 1220.

For example, two first non-conductive members 1215 and 1216 may bedisposed in the first housing portion 1210 and two second non-conductivemembers 1225 and 1226 may be disposed in the second housing portion1220. The two first non-conductive members 1215 and 1216 disposed in thefirst housing portion 1210 and the two second non-conductive members1225 and 1226 disposed in the second housing portion 1220 may bearranged to be aligned to each other. For example, in the state wherethe electronic device 1200 is folded, first non-conductive members 1215and 1216 and second non-conductive members 1225 and 1226 may be arrangedon the metal frames to be symmetric in the vertical direction and in thehorizontal direction.

The non-conductive members disposed in the electronic device 1200 may bearranged not only in the regions of the first and second metal frames1211 and 1221 of the first and second housing portions 1210 and 1220,but also in the second metal frames 1212 and 1222, the third metalframes 1213 and 1223, or the fourth metal frames 1214 and 1224 of thefirst and second housing portions as the same arrangement structures.

The electronic device 1200 may further include a connection part 1230.The electronic device 1200 may be different from the electronic device400 illustrated in FIGS. 4A to 4D in terms of the arrangement positionsof the non-conductive members disposed in each of the first and secondhousing portions 1210 and 1220. The metal frames forming the rim of thefirst housing portion 1210 may include first to fourth metal frames 1211to 1214. The metal frames forming the rim of the second housing portion1220 may include first to fourth metal frames 1221 to 1224.

The fourth metal frame 1214 of the first housing 1210 may include one ormore of the first non-conductive members 1215 and 1216. The firstnon-conductive members 1215 and 1216 may be mounted on the fourth metalframe to be symmetric to each other.

Each of the metal frames, which are split by respective firstnon-conductive members 1215 and 1216, may be used as an antennaradiator. The fourth metal frame may be a center metal frame that isprovided by a pair of the first non-conductive members 1215 and 1216formed at a predetermined interval. When the first metal frame 1214 isfed with power to operate as an antenna radiator, at least a portion ofeach of the first and second metal frames 1211 and 1212 may beelectrically coupled to the fourth metal frame 1214 to operate as anantenna radiator. The first non-conductive members 1215 and 1216 may beformed by filling a gap (i.e., an opening) between the metal frames witha non-conductive material.

The fourth metal frame 1214 of the first housing portion may furtherinclude side metal frames 1211 a and 1212 a that respectively extendfrom the first and second metal frames 1211 and 1212 and are bent at aright angle. The first non-conductive members 1215 and 1216 may bearranged between the fourth metal frame 1214 and the side metal frames1211 a and 1212 a, respectively. When the fourth metal frame 1214 is fedwith power, the fourth metal frame 1214 may operate as an antennaradiator that is fed with power from a power feeding circuit so as toform resonance. When the fourth metal frame 1214 is fed with power fromthe power feeding circuit to operate as an antenna radiator, at least aportion of the side metal frame 1211 a and the first metal frame 1211 orat least a portion of the side metal frame 1212 a and the second metalframe 1212 is electrically coupled to each other so as to operate as aportion of the antenna radiator.

The fourth metal frame 1224 of the second housing portion 1220 mayinclude one or more of the second non-conductive members 1225 and 1226.Each of the second non-conductive members 1225 and 1226 maybe mounted onthe fourth metal frame 1224 to be symmetric to each other.

Each of the metal frames 1224, which are split by the respective secondnon-conductive members 1225 and 1226, may be used as an antennaradiator. The fourth metal frame 1224 of the second housing portion maybe a center frame 1224 that is provided by the second non-conductivemembers 1225 and 1226 formed at a predetermined interval. When thefourth metal frame 1224 of the second housing portion is fed with powerby a power feeding circuit to operate as at least a portion of anantenna radiator that forms resonance, at least a portion of each of thefirst and second metal frames 1221 and 1222 may be electrically coupledto the center metal frame 1224 to operate as an antenna radiator. Thesecond non-conductive members 1225 and 1226 may be formed by filling agap (i.e., an opening) between the metal frames with a non-conductivematerial.

The fourth metal frame 1224 of the second housing portion may furtherinclude side metal frames 1221 a and 11222 a that respectively extendfrom the first and second metal frames 1211 and 1212 and are then bentat a right angle. The second non-conductive members 1225 and 1226 may bearranged between the fourth metal frame 1224 of the second housingportion and the top side metal frames 1221 a and 1222 a, respectively.When the fourth metal frame 1224 is fed with power by a power feedingcircuit, the fourth metal frame 1224 may operate as an antenna radiatorthat forms resonance. When the fourth metal frame 1224 is fed with powerfrom the power feeding circuit to operate as a radiator, at least aportion of the side metal frame 1221 a and the first metal frame 1221 orat least a portion of the side metal frame 1222 a and the second metalframe 1222 is electrically coupled to each other so as to operate as anantenna radiator.

In the electronic device 1200, the first non-conductive members 1215 and1216 and the second non-conductive members 1225 and 1226 may be arrangedto be substantially symmetrically aligned to each other when viewed withreference to the YZ plane. For example, the first non-conductive members1215 and 1216 and the second non-conductive members 1225 and 1226 may besubstantially aligned in the vertical direction with reference to the Zaxis.

The fourth metal frame 1214 of the first housing portion 1210 and thefourth metal frame 1224 of the second housing 1220 may be aligned to bevertically symmetric to each other along the Z axis.

With this arrangement, the electronic device 1200 may maintain theradiation effect of the antenna even in the state where the firsthousing portion 1210 and the second housing portion 1220 are disposedclose to each other (i.e., when the electronic device 1200 is in afolded state).

When the second housing portion 1220 is disposed closed to the firsthousing portion 1210 (i.e. when the first non-conductive members 1215and 1216 and the second non-conductive members 1225 and 1226 aresymmetrically aligned), radiation radiated from the antenna radiatorformed by at least a portion of the first housing portion 1210 may beradiated through the second non-conductive member (i.e., the opening) ofthe second housing portion 1220.

The first non-conductive members 1215 and 1216 and the secondnon-conductive members 1225 and 1226 may be equally arranged on thethird frames 1213 and 1223 of the first and second housing portions,respectively.

The disposed number of each of the first non-conductive members 1215 and1216 and the second non-conductive members 1225 and 1226 does not needto be limited to two, and may be one or three or more.

When the first face of the first housing portion 1210 and the first faceof the second housing portion 1220 of the electronic device 1200 faceeach other, the first non-conductive members 1215 and 1216 and thesecond non-conductive members 1225 and 1226 are substantially aligned sothat antenna radiation may be executed through the open region of theantenna formed in the first housing portion 1210 and an open region ofthe second housing portion 1220 substantially aligned thereto. Thus,when the antenna radiation is executed to the open region of the secondhousing 1220, the deterioration of the antenna radiation performance canbe prevented.

FIGS. 13A and 13B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 13A and 13B, a folder-type electronic device 1300 isshown. In FIGS. 13A and 13B, perspective views of the electronic device1300 in a folded and unfolded state, respectively, are provided. Theelectronic device 1300, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 13A and 13B, at least a portion of a housing of the electronicdevice 1300 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1310 and/or asecond housing portion 1320 of the electronic device 1300.

The electronic device 1300 may include one or more non-conductivemember, which may be disposed in each of the first housing portion 1310and the second housing portion 1320. Non-conductive members may bearranged in the first housing portion 1310 and the second housingportion 1320, respectively, and the number of non-conductive membersarranged in the first housing portion 1310 may be different from thenumber of non-conductive members arranged in the second housing portion1320. Non-conductive members may be symmetrically arranged in the firsthousing portion 1310 and the second housing portion 1320, respectively,and the number of non-conductive members arranged in the first housingportion 1310 may be different from the number of non-conductive membersarranged in the second housing portion 1320.

For example, two first non-conductive members 1315 and 1316 may bedisposed in the first housing portion 1310 and one second non-conductivemember 1325 may be disposed in the second housing portion 1320. Onenon-conductive member 1315 of the first housing portion 1310 and thesecond non-conductive member 1325 of the second housing portion 1320 maybe arranged to be substantially aligned to each other when the firsthousing portion 1310 and the second housing portion 1320 face eachother. In the state where the electronic device 1300 is folded, firstnon-conductive members 1315 and 1316 and second non-conductive member1325 may be arranged on the metal frames to be asymmetric in thevertical direction and in the horizontal direction.

The non-conductive members disposed in the electronic device 1300 may bearranged not only in the regions of the first and second metal frames1311 and 1321 of the first and second housing portions 1310 and 1320,but also in the second metal frames 1312 and 1322, the third metalframes 1313 and 1323, or the fourth metal frames 1314 and 1324 of thefirst and second housing portions 1310 and 1320 as the same arrangementstructures.

The electronic device 1300 is different from the electronic device 1200illustrated in FIGS. 12A and 12B only in the configuration of the secondhousing portion 1320, The configurations of the remaining components,(i.e., the first housing portion 1310 and a connection part 1330 are thesame as those of the electronic device 1200 illustrated in FIGS. 12A to12B). Thus, descriptions of the first housing portion 1310 and theconnection part 1330 will be omitted. The rim of the second housingportion 1320 of the electronic device 1300 may include a plurality ofmetal frames (i.e., conductive portions). The metal frames may includefirst to fourth metal frames 1321 to 1324 depending on the disposedpositions thereof.

The fourth metal frame 1324 may include the second non-conductive member1325. Each of the metal frames 1321 and 1324, which are split by thesecond non-conductive member 1325, may be used as an antenna radiator.The second non-conductive member 1325 may be disposed at a side of thefourth metal frame 1324. In the state illustrated in FIG. 13A, the firstnon-conductive members 1315 and 1316 and the second non-conductivemember 1325 may be arranged asymmetrically in the vertical direction andin the horizontal direction. In the state where the first and secondhousing portions 1310 and 1320 are folded, the first non-conductivemember 1315 and the second non-conductive member 1325 may be disposed tobe superimposed one on another, which may improve an antenna radiationefficiency. The second non-conductive member 1325 may be formed byfilling a gap (i.e., an opening) between the metal frames 1321 and 1324with a non-conductive material.

The disposed number of each of the first non-conductive members 1315 and1316 and the second non-conductive members 1326 in each of the first andsecond housing portions 1310 and 1320 does not need to be limited, and aplurality of non-conductive members may be variously disposed.

When the first face of the first housing portion 1310 and the first faceof the second housing portion 1320 of the electronic device 1300 faceeach other, the first non-conductive member 1315 and the secondnon-conductive member 1325 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1310 and an open region of the secondhousing portion 1320 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1320, the deterioration of the antenna radiation performance can beprevented.

FIGS. 14A and 14B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 14A and 14B, a folder-type electronic device 1400 isshown. In FIGS. 14A and 14B, perspective views of the electronic device1400 in a folded and unfolded state, respectively, are provided. Theelectronic device 1400, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 14A and 14B, at least a portion of a housing of the electronicdevice 1400 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1410 and/or asecond housing portion 1420 of the electronic device 1400.

The electronic device 1400 may include one or more non-conductivemembers, which are disposed on the first housing portion 1410 and thesecond housing portion 1420, respectively. Non-conductive members may bearranged in the first housing portion 1410 and the second housingportion 1420, respectively, and the number of non-conductive membersarranged in the first housing portion 1410 may be different from thenumber of non-conductive members arranged in the second housing portion1420. Non-conductive members may be asymmetrically arranged in the firsthousing portion 1410 and the second housing portion 1420, respectively,and the number of non-conductive members arranged in the first housingportion 1410 may be different from the number of non-conductive membersarranged in the second housing portion 1420.

For example, one first non-conductive member 1415 may be disposed in thefirst housing portion 1410 and two second non-conductive members 1425and 1426 may be disposed in the second housing portion 1420. The firstnon-conductive member 1415 disposed in the first housing portion 1410and one first non-conductive member 1425 disposed in the second housingportion 1420 may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 1400 may bearranged not only in the regions of the first and second metal frames1411 and 1421 of the first and second housing portions 1410 and 1420,but also in the second metal frames 1412 and 1422, the third metalframes 1413 and 1423, or the fourth metal frames 1414 and 1424 of thefirst and second housing portions 1410 and 1420 as the same arrangementstructures.

The electronic device 1400 is different from the electronic deviceillustrated in FIGS. 12A and 12B only in the configuration of the firsthousing portion 1410. The configurations of the remaining components(i.e., the second housing portion 1420 and a connection part 1430 arethe same as those of the electronic device 1200 illustrated in FIGS. 12Aand 12B). Thus, descriptions of the second housing portion 1420 and theconnection part 1430 will be omitted. The rim of the first housingportion 1410 of the electronic device 1400 may include a plurality ofmetal frames (i.e., conductive portions). The metal frames may includefirst to fourth metal frames 1411 to 1414 depending on the disposedpositions thereof.

The fourth metal frame 1414 may include the first non-conductive member1415. Each of the metal frames 1411 and 1414, which are split by thefirst non-conductive member 1415, may be used as an antenna radiator.The first non-conductive member 1415 may be disposed at a side of thefourth metal frame 1414. In the state illustrated in FIG. 14A, the firstnon-conductive member 1415 and the second non-conductive members 1425and 1426 may be arranged. asymmetrically in the vertical direction andin the horizontal direction. In the state where the first and secondhousing portions 1410 and 1420 are folded, the first non-conductivemember 1415 and the one second non-conductive member 1425 may bedisposed to be superimposed one on another, which may improve an antennaradiation efficiency.

When the first face of the first housing portion 1410 and the first faceof the second housing portion 1420 of the electronic device 1400 faceeach other, the first non-conductive member 1415 and the one secondnon-conductive member 1425 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1410 and an open region of the secondhousing portion 1420 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1420, the deterioration of the antenna radiation performance can beprevented.

Each of the first and second non-conductive members 1415, 1425, and 1426may be equally arranged the third frames 1413 and 1423 of the first andsecond housing portions, respectively.

FIGS. 15A and 15B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 15A and 15B, a folder-type electronic device 1500 isshown. In FIGS. 15A and 15B, perspective views of the electronic device1500 in a folded and unfolded state, respectively, are provided. Theelectronic device 1500, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 15A and 15B, at least a portion of a housing of the electronicdevice 1500 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 1510 and/or asecond housing portion 1520 of the electronic device 1500.

The electronic device 1500 may include one non-conductive member, whichis disposed in each of the first housing portion 1510 and the secondhousing portion 1520. Non-conductive members may be arranged in thefirst housing portion 1510 and the second housing portion 1520,respectively, and the number of non-conductive members arranged in thefirst housing portion 1510 may be the same as the number ofnon-conductive members arranged in the second housing portion 1520.Non-conductive members may be symmetrically arranged in the firsthousing portion 1510 and the second housing portion 1520, respectively,and the number of non-conductive members arranged in the first housingportion 1510 may be the same as the number of non-conductive membersarranged in the second housing portion 1520.

For example, one first non-conductive member 1515 may be disposed in thefirst housing portion 1510 and one second non-conductive member 1525 maybe disposed in the second housing portion 1520. The first non-conductivemember 1515 disposed in the first housing portion 1510 and secondnon-conductive member 1525 disposed in the second housing portion 1520may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 1500 may bearranged not only in the regions of the first and second metal frames1511 and 1521 of the first and second housing portions 1510 and 1520,but also in the second metal frames 1512 and 1522, the third metalframes 1513 and 1523, or the fourth metal frames 1514 and 1524 of thefirst and second housing portions 1510 and 1520 as the same arrangementstructures.

The configuration of both the first and second housing portions 1510 and1520 of the electronic device 1500 is the same as that of the firsthousing portion 1410 illustrated in FIGS. 14A and 14B, and thus,detailed descriptions thereof will be omitted. The first metal frame1511 of the first housing portion may include the first non-conductivemember 1515. Each of the metal frames 1511 and 1512, which are split bythe first non-conductive member 1515, may be used as an antennaradiator. The first non-conductive member 1515 of the first housingportion may be disposed at a side of the first metal frame 1511. Thefirst metal frame 1521 of the second housing portion may include thesecond non-conductive member 1525. Each of the metal frames 1521 and1522, which are split by the second non-conductive member 1525, may beused as an antenna radiator. The second non-conductive member 1525 maybe disposed at a side of the first metal frame 1521.

In the state illustrated in FIG. 15A, the first and secondnon-conductive members 1515 and 1525 may be arranged symmetrically inthe vertical direction and asymmetrically in the horizontal direction.In the state where the first and second housing portions 1510 and 1520are folded, each of the first and second non-conductive members 1515 and1525 may be disposed to be superimposed one on another, which mayimprove an antenna radiation efficiency.

When the first face of the first housing portion 1510 and the first faceof the second housing portion 1520 of the electronic device 1500 faceeach other, the first non-conductive member 1515 and the secondnon-conductive member 1525 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1510 and an open region of the secondhousing portion 1520 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1520, the deterioration of the antenna radiation performance can beprevented.

FIGS. 16A and 16B illustrate a folder-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 16A and 16B, a folder-type electronic device 1600 isshown. In FIGS. 16A and 16B, perspective views of the electronic device1600 in a folded and unfolded state, respectively, are provided. Theelectronic device 1600, according to various embodiments, may be thesame as the electronic device 101 of FIG. 1.

In FIGS. 16A and 16B, at least a portion of a housing of the electronicdevice 1600 forms at least a portion of an antenna. For example, atleast one gap may be formed in each of a first housing portion 1610and/or a second housing portion 1620 of the electronic device 1600.

In the electronic device 1600, four first non-conductive members 1615 a,1616 a, 1615 b, and 1616 b may be disposed in the first housing portion1610, and four second non-conductive members 1625 a, 1626 a, 1625 b, and1626 b may he disposed in the second housing portion 1620. According tovarious embodiments, the first non-conductive members 1615 a, 1616 a,1615 b, and 1616 b of the first housing portion 1610 may be arranged tobe symmetric to, and in the same number as the second non-conductivemembers 1625 a, 1626 a, 1625 b, and 1626 b.

For example, the first non-conductive members 1615 a, 1616 a, 1615 b,and 161.6 b of the first housing portion 1610 may be disposed in thefirst and fourth metal frames 1611 and 1614, and the secondnon-conductive members 1625 a, 1626 a, 1625 b, and 1626 b of the secondhousing portion 1620 may be disposed in the first and fourth metalframes 1621 and 1624. In addition, the first and second non-conductivemembers disposed in the first and second housing portions 1610 and 1620may be arranged to be aligned to each other.

For example, in the state where the electronic device 1600 is folded,the first non-conductive members 1615 a, 1616 a, 1615 b, and 1616 bdisposed in the first housing portion 1610 may be arranged in the firstand fourth metal frames 1611 and 1614 symmetrically in the verticaldirection and in the horizontal direction, and the second non-conductivemembers 1625 a, 1626 a, 1625 b, and 1626 b disposed in the secondhousing portion 1620 may be arranged in the first and fourth metalframes 1621 and 1624 symmetrically in the vertical direction and in thehorizontal direction.

The non-conductive members disposed in the electronic device 1600 mayarranged not only in the regions of the first and fourth metal frames1611, 1621, 1614, and 1624 of the first and second housing portions 1610and 1620, but also in the second and fourth metal frames 1612, 1613,1622, and 1623 of the first and second housing portions as the samearrangement structures.

In the electronic device 1600, the configurations of the firstnon-conductive members 1615 a and 1616 a and the second non-conductivemembers 1625 a and 1626 a, which are respectively disposed in the firstmetal frames 1611 and 1621 of the first and second housing portions 1610and 1620, are the same as those of the first non-conductive members 515and 516 and second non-conductive members 525 and 526, which arerespectively disposed in the first metal frames 511 and 521 of the firstand second housing portions 510 and 520 that have been described withreference to FIGS. 5A and 5B, and thus detailed descriptions thereofwill be omitted. In the electronic device 1600, the configurations ofthe first non-conductive members 1615 b and 1616 b and secondnon-conductive members 1625 b, and 1626 b, which are respectivelydisposed in the fourth metal frames 1614 and 1624 of the first andsecond housing portions 1610 and 1620, are the same as those of thefirst non-conductive members 1215 and 1216 and second non-conductivemembers 1225 and 1226, which are respectively disposed in the fourthmetal frames 1214 and 1224 of the first and second housings 1210 and1220 that have been described with reference to FIGS. 12A and 12B, andthus detailed descriptions thereof will be omitted.

In the electronic device 1600, the first non-conductive members 1615 aand 1616 a of the first housing portion and the second non-conductivemembers 1625 a and 1626 a of the second housing portion may be arrangedto be substantially symmetrically aligned to each other when viewed withreference to the YZ plane. For example, in the electronic device 1600,the first non-conductive members 1615 a, and 1616 a of the first housingportion and the second non-conductive members 1625 a and 1626 a of thesecond housing portion may be arranged to be substantially aligned toeach other in the vertical direction and in the horizontal directionwith reference to the Z axis.

In the electronic device 1600, the first non-conductive members 1615 band 1616 b of the first housing portion and the second non-conductivemembers 1625 b and 1626 b of the second housing portion may be arrangedto be substantially symmetrically aligned to each other when viewed withreference to the XZ plane. For example, the first non-conductive members1615 b and 1616 b of the first housing portion and the secondnon-conductive members 1625 b and 1626 b of the second housing portionmay be arranged to be substantially aligned to each other in thevertical direction and in the horizontal direction with reference to theZ axis. According to various embodiments, when the first face of thefirst housing portion 1610 and the first face of the second housingportion 1620 of the electronic device 1600 face each other, the firstnon-conductive members 1615 a, 1616 a and the second non-conductivemembers 1625 a and 1626 a and the first non-conductive members 1615 band 1616 b and the second non-conductive members 1625 b and 1626 b aresubstantially aligned so that antenna radiation may be executed throughthe open region of the antenna formed in the first housing portion 1610and an open region of the second housing portion 1620 substantiallyaligned thereto. Thus, when the antenna radiation is executed to theopen region of the second housing 1620, the deterioration of the antennaradiation performance can be prevented.

With this arrangement, the electronic device 1600 may maintain theradiation effect of the antenna even in the state where the firsthousing portion 1610 and the second housing portion 1620 are disposedclose to each other (i.e., when the electronic device 1600 is in afolded state).

FIG. 17 illustrates a folder-type electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 17, a perspective view of a folder-type electronicdevice 1700 in the folded state is shown. The electronic device 1700,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIG. 17, at least a portion of a housing of the electronic device1700 forms at least a portion of an antenna. For example, at least onegap may be formed in a first housing portion 1710 and/or a secondhousing portion 1720 of the electronic device 1700. The electronicdevice 1700 is provided with a connection part 1730 so as to fold orunfold the first and second housing portions 1710 and 1720, in which theconnection part 1730 may be disposed along the vertical side (Y axis) ofthe first and second housing portions 1710 and 1720.

The electronic device 1700 may include one or more non-conductivemember, which may be disposed in each of the first housing portion 1710and the second housing portion 1720. Non-conductive members may bearranged in the first housing portion 1710 and the second housingportion 1720, respectively, and the number of non-conductive membersarranged in the first housing portion 1710 may be the same as the numberof non-conductive members arranged in the second housing portion 1720.Non-conductive members may be symmetrically arranged in the firsthousing portion 1710 and the second housing portion 1720, respectively,and the number of non-conductive members arranged in the first housingportion 1710 may be the same as the number of non-conductive membersarranged in the second housing portion 1720.

For example, in the state where the electronic device 1700 is folded,two first non-conductive members 1715 and 1716 may be disposed in thefirst housing portion 1710 and two second non-conductive members 1725and 1726 may be disposed in the second housing portion 1720. The firstnon-conductive members 1715 and 1716 disposed in the first housingportion 1710 and the second non-conductive members 1725 and 1726disposed in the second housing portion 1720 may be arranged to bealigned to each other. For example, in the state where the electronicdevice 1700 is folded, first non-conductive members 1715 and 1716 andsecond non-conductive members 1725 and 1726 may be arranged on the metalframes to be symmetric in the vertical direction and in the horizontaldirection.

The non-conductive members disposed in the electronic device 1700 may bearranged not only in the regions of the first and second metal frames1711 and 1721 of the first and second housing portions 1710 and 1720,but also in the second metal frames 1712 and 1722 of the first andsecond housing portions, the third metal frame 1723 of the first andsecond housing portions 1710 and 1720, or the fourth metal frame 1724 ofthe first and second housing portions 1710 and 1720 as the samearrangement structures.

In the electronic device 1700, the configurations of the firstnon-conductive members 1715 and 1716 and the second non-conductivemembers 1725 and 1726, which are respectively disposed in the firstmetal frames 1711 and 1721 of the first and second housing portions 1710and 1720, are the same as those of the non-conductive members 515, 516,525, and 526, which are respectively disposed in the first metal frames511 and 521 of the first and second housings 510 and 520 that which havebeen described with reference to FIGS. 5A and 5B, and thus, detaileddescriptions thereof will be omitted.

In the electronic device 1700, the first non-conductive members 1715 and1716 and the second non-conductive members 1725 and 1726 may be arrangedto be substantially symmetrically aligned to each other when viewed withreference to the XZ plane. For example, the first non-conductive members1715 and 1716 and the second non-conductive members 1725 and 1726 may besubstantially aligned in the vertical direction and in the horizontaldirection with reference to the Z axis.

With this arrangement, the electronic device 1700 may improve theradiation efficiency of the antenna even in the state where the firsthousing portion 1710 and the second housing portion 1720 are disposedclose to each other (i.e., when the electronic device 1700 is in afolded state). When the first face of the first housing portion 1710 andthe first face of the second housing portion 1720 of the electronicdevice 1700 face each other, the first non-conductive members 1715 and1716 and the second non-conductive members 1725 and 1726 aresubstantially aligned so that antenna radiation may be executed throughthe open region of the antenna formed in the first housing portion 1710and an open region of the second housing portion 1720 substantiallyaligned thereto. Thus, when the antenna radiation is executed to theopen region of the second housing 1720, the deterioration of the antennaradiation performance can be prevented.

FIG. 18 illustrates a folder-type electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 18, a perspective view of a folder-type electronicdevice 1800 in the folded state is shown. The electronic device 1800,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIG, 18, at least a portion of a housing of the electronic device1800 forms at least a portion of an antenna. For example, at least onegap may be formed in a first housing portion 1810 and/or a secondhousing portion 1820 of the electronic device 1800.

The electronic device 1800 may include one or more non-conductivemembers, which are disposed on the first housing portion 1810 and thesecond housing portion 1820, respectively. Non-conductive members may bearranged in the first housing portion 1810 and the second housingportion 1820, respectively, and the number of non-conductive membersarranged in the first housing portion 1810 may be different from thenumber of non-conductive members arranged in the second housing portion1820. Non-conductive members may be asymmetrically arranged in the firsthousing portion 1810 and the second housing portion 1820, respectively,and the number of non-conductive members arranged in the first housingportion 1810 may be different from the number of non-conductive membersarranged in the second housing portion 1820.

For example, at least two first non-conductive members 1815 and 1816 maybe disposed in the first housing portion 1810 and one secondnon-conductive member 1825 may be disposed in the second housing portion1820. One first non-conductive member 1815 disposed in the first housingportion 1810 and the second non-conductive member 1825 disposed in thesecond housing portion 1820 may be arranged to be aligned to each other.

For example, the non-conductive members disposed in the electronicdevice 1800 may be arranged not only in the regions of the first andsecond metal frames 1811 and 1821 of the first and second housingportions 1810 and 1820, but also in the second metal frames 1812 and1822 of the first and second housing portions, the third metal frame1823 of the first and second housing portions, or the fourth metal frame1824 of the first and second housing portions as the same arrangementstructures.

The electronic device 1800 may further include a connection part 1830.The connection part 1830 may be disposed along the vertical direction (Yaxis) of the first and second housing portions 1810 and 1820. In theelectronic device 1800, the configurations of the first non-conductivemembers 1815 and 1816 and the second non-conductive member 1825, whichare respectively disposed in the first metal frames 1811 and 1821 of thefirst and second housing portions 1810 and 1820, are the same as thoseof the first and second non-conductive members 915, 916, and 925, whichare respectively disposed in the first metal frames 911 and 921 of thefirst and second housings 910 and 920, which have been described withreference to FIGS. 9A and 9B, and thus, detailed descriptions thereofwill be omitted.

In the electronic device 1800, the first non-conductive members 1815 and1816 of the first housing portion and the second non-conductive member1825 of the second housing portion may be arranged to be substantiallyasymmetrically aligned to each other when viewed with reference to theXZ plane. For example, the first non-conductive members 1815 and 1816and the second non-conductive member 1825 may be arranged substantiallyasymmetrically in the vertical direction and in the horizontaldirection.

When the first face of the first housing portion 1810 and the first faceof the second housing portion 1820 of the electronic device 1800 faceeach other, the one first non-conductive member 1815 and the secondnon-conductive member 1825 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1810 and an open region of the secondhousing portion 1820 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1820, the deterioration of the antenna radiation performance can beprevented.

In the state where the first and second housing portions 1810 and 1820are folded, each of the non-conductive members 1815 and 1825 may bedisposed to be superimposed one on another, which may improve an antennaradiation efficiency.

FIG. 19 illustrates a folder-type electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 19, a perspective view of a folder-type electronicdevice 1900 in the folded state is shown. The electronic device 1900,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIG, 19, at least a portion of a housing of the electronic device1900 forms at least a portion of an antenna. For example, at least onegap may be formed in a first housing portion 1910 and/or a secondhousing portion 1920 of the electronic device 1900.

The electronic device 1900 may include one or more non-conductivemembers, which are disposed on the first housing portion 1910 and thesecond housing portion 1920, respectively. Non-conductive members may bearranged in the first housing portion 1910 and the second housingportion 1920, respectively, and the number of non-conductive membersarranged in the first housing portion 1910 may be different from thenumber of non-conductive members arranged in the second housing portion1920. Non-conductive members may be asymmetrically arranged in the firsthousing portion 1910 and the second housing portion 1920, respectively,and the number of non-conductive members arranged in the first housingportion 1910 may be different from the number of non-conductive membersarranged in the second housing portion 1920.

For example, one first non-conductive member 1915 may be disposed in thefirst housing portion 1910 and two or more second non-conductive members1925 and 1926 may be disposed in the second housing portion 1920. Thefirst non-conductive member 1915 disposed in the first housing portion1910 and one second non-conductive member 1925 disposed in the secondhousing portion 1920 may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 1900 may bearranged not only in the regions of the first and second metal frames1911 and 1921 of the first and second housing portions 1910 and 1920,but also in the second metal frames 1912 and 1922 of the first andsecond housing portions, the third metal frame 1923 of the first andsecond housing portions, or the fourth metal frame 1924 of the first andsecond housing portions as the same arrangement structures.

The electronic device 1900 may further include a connection part 1930.In the electronic device 1900, the configurations of the first andsecond non-conductive members 1915, 1925, and 1926, which arerespectively disposed in the first metal frames 1911 and 1921 of thefirst and second housing portions 1910 and 1920, are the same as thoseof the non-conductive members 1015, 1025, and 1026, which arerespectively disposed in the first metal frames 1011 and 1021 of thefirst and second housings 1010 and 1020, which have been described withreference to FIGS. 10A and 10B, and thus, detailed descriptions thereofwill be omitted.

In the electronic device 1900, the second non-conductive members 1925and 1926 and the first non-conductive member 1915 may be arranged to besubstantially asymmetrically aligned to each other when viewed withreference to the XZ plane. For example, the first non-conductive member1915 and the second non-conductive members 1925 and 1926 may be arrangedsubstantially asymmetrically in the vertical direction and in thehorizontal direction.

When the first face of the first housing portion 1910 and the first faceof the second housing portion 1920 of the electronic device 1900 faceeach other, the first non-conductive member 1915 and the one secondnon-conductive member 1925 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 1910 and an open region of the secondhousing portion 1920 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing1920, the deterioration of the antenna radiation performance can beprevented.

In the state where the first and second housing portions 1910 and 1920are folded, each of the non-conductive members 1915 and 1925 may bedisposed to be superimposed one on another, which may improve an antennaradiation efficiency.

FIG. 20 illustrates a folder-type electronic device, according to anembodiment of the present disclosure.

Referring to FIG. 20, a perspective view of a folder-type electronicdevice 2000 in the folded state is shown. The electronic device 2000,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIG. 20, at least a portion of a housing of the electronic device2000 forms at least a portion of an antenna. For example, at least onegap may be formed in a first housing portion 2010 and/or a secondhousing portion 2020 of the electronic device 2000.

The electronic device 2000 may include one or more non-conductivemembers, which are disposed in each of the first housing portion 2010and the second housing portion 2020. According to various embodiments,non-conductive members 2015 and 2025 may be arranged in the firsthousing portion 2010 and the second housing portion 2020, respectively,and the number of non-conductive members arranged in the first housingportion 2010 may be the same as the number of non-conductive membersarranged in the second housing portion 2020. Non-conductive members maybe symmetrically arranged in the first housing portion 2010 and thesecond housing portion 2020, and the number of non-conductive membersarranged in the first housing portion 2010 may be the same as the numberof non-conductive members arranged in the second housing portion 2020.

For example, a first non-conductive member 2015 may be disposed in thefirst housing portion 2010 and a second non-conductive member 2025 maybe disposed in the second housing portion 2020. The first non-conductivemember 2015 disposed in the first housing portion 2010 and the secondnon-conductive member 2025 disposed in the second housing portion 2020may be arranged to be aligned to each other.

The non-conductive members disposed in the electronic device 2000 may bearranged not only in the regions of the first and second metal frames2011 and 2021 of the first and second housing portions 2010 and 2020,but also in the second metal frames 2012 and 2022 of the first andsecond housing portions, the third metal frame 2023 of the first andsecond housing portions, or the fourth metal frame 2024 of the first andsecond housing portions as the same arrangement structures.

The electronic device 2000 may further include a connection part 2030.In the electronic device 2000, the configurations of the first andsecond non-conductive members 2015 and 2016, which are respectivelydisposed in the first metal frames 2011 and 2021 of the first and secondhousing portions 2010 and 2020, are the same as those of the first andsecond non-conductive members 1115 and 1125 which are respectivelydisposed in the first metal frames 1111 and 1121 of the first and secondhousings 1110 and 1120, which have been described with reference toFIGS. 11A and 11B, and thus, detailed descriptions thereof will beomitted.

In the electronic device 2000, each of first and second non-conductivemembers 2015 and 2025 may be arranged to be substantially asymmetricallyaligned to each other when viewed with reference to the XZ plane. Forexample, the each of the first and second non-conductive members 2015and 2025 may be arranged substantially symmetrically in the verticaldirection, and may be arranged substantially asymmetrically in thehorizontal direction.

When the first face of the first housing portion 2010 and the first faceof the second housing portion 2020 of the electronic device 2000 faceeach other, the first non-conductive member 2015 and the secondnon-conductive member 2025 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 2010 and an open region of the secondhousing portion 2020 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housingportion 2020, the deterioration of the antenna radiation performance canbe prevented.

When the first and second housing portions 2010 and 2020 are folded,each of the first and second non-conductive members 2015 and 2025 may bedisposed to be superimposed one on another, which may improve an antennaradiation efficiency.

FIGS. 21A to 21C illustrate a sliding-type electronic device, accordingto an embodiment of the present disclosure.

Referring to FIGS. 21A to 21C, a sliding-type electronic device 2100 isshown. In FIG. 21A, a perspective view of the electronic device 2100 inclosed state, is provided. In FIGS. 21B and 21C, perspective views ofthe electronic device 2100 in states in which a housing portion of theelectronic device 2100 is slid open in horizontal and verticaldirections, respectively, is provided. The electronic device 2100,according to various embodiments, may be the same as the electronicdevice 101 of FIG. 1.

In FIGS. 21A to 21C, at least a portion of a housing of the electronicdevice 2100 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 2110 and/or asecond housing portion 2120 of the electronic device 2100.

In the electronic device 2100, first non-conductive members 2115 and2116 may be disposed in the first housing portion 2110, and secondnon-conductive members 2125 and 2126 may be disposed in the secondhousing portion 2120. The first non-conductive members 2115 and 2116 ofthe first housing portion 2110 and the second non-conductive members2125 and 2126 of the second housing portion 2120 may be arrangedsymmetrically, in which the number of the first non-conductive membersmay be the same as the number of the second non-conductive members. Forexample, the first non-conductive members 2115 and 2116 may be disposedin the first metal frame 2111 of the first housing portion 2110 and thesecond non-conductive members 2125 and 2126 may be disposed in the firstmetal frame 2121 of the second housing portion 2120, in which the firstnon-conductive members 2115 and 2116 and the second non-conductivemembers 2125 and 2126 may be arranged to be aligned to each other.

For example, the first non-conductive members 2115 and 2116 disposed inthe first housing portion 2110 may be arranged in the first metal frame2111 symmetrically in the horizontal direction, and the secondnon-conductive members 2125 and 2126 disposed in the second housingportion 2120 may be arranged in the first metal frame 2121 symmetricallyin the horizontal direction.

The non-conductive members disposed in the electronic device 2100 may bearranged not only in the region of the first metal frames 2111 and 2121of the first and second housing portions 2110 and 2120, but also in eachof the second to fourth metal frames of the first and second housingportions as the same arrangement structures.

The electronic device 2100 may further include a sliding module. In theelectronic device 2100, the second housing portion 2020 may be slid onthe in the horizontal direction by the sliding module so as toopen/close the top surface of the first housing portion 2010. The secondhousing portion 2020 may be slid on the in the vertical direction by thesliding module so as to open/close the top surface of the first housingportion 2010. In the electronic device 2100, the configurations of thefirst and second non-conductive members 2115, 2116, 2125, and 2126,which are respectively disposed in the first metal frames 2111 and 2121of the first and second housing portions 2110 and 2120, are the same asthose of the first and second non-conductive members 515, 516, 525, and526, which are respectively disposed in the first metal frames 511 and521 of the first and second housing portions 510 and 520 that have beendescribed with reference to FIGS. 5A and 5B, and thus, detaileddescriptions thereof will be omitted.

In the electronic device 2100, each of the first and secondnon-conductive member 2115, 2116, 2125, and 2126 may be arranged to besubstantially symmetrically aligned to each other when viewed withreference to the YZ plane. For example, each of the non-conductivemembers 2115, 2116, 2125, and 2126 may be arranged substantiallysymmetrically in the vertical direction, and may be arrangedsubstantially symmetrically in the horizontal direction.

When the first face of the first housing portion 2110 and the first faceof the second housing portion 2120 of the electronic device 2100 faceeach other, the first non-conductive members 2115 and 2116 and thesecond non-conductive members 2125 and 2126 are substantially aligned sothat antenna radiation may be executed through the open region of theantenna formed in the first housing portion 2110 and an open region ofthe second housing portion 2120 substantially aligned thereto. Thus,when the antenna radiation is executed to the open region of the secondhousing 2120, the deterioration of the antenna radiation performance canbe prevented.

When the first and second housing portions 2110 and 2120 are verticallyaligned, the non-conductive members 2115, 2116, 2125, and 2126 may bedisposed to be superimposed one on another, which may improve an antennaradiation efficiency.

FIGS. 22A to 22C illustrate a flexible electronic device, according toan embodiment of the present disclosure.

Referring to FIGS. 22A to 22C, a flexible electronic device 2200 isshown. In FIG. 22A, a perspective view of the electronic device 2200 inflat state is provided. In FIG. 22B, a perspective view of theelectronic device 2200 in a bent state is provided. In FIG. 22C, aperspective view of the electronic device 2200 in a folded state isprovided. The electronic device 2200, according to various embodiments,may be the same as the electronic device 101 of FIG. 1.

In FIGS. 22A to 22C, at least a portion of a housing of the electronicdevice 2200 forms at least a portion of an antenna. For example, atleast one gap may be formed in a first housing portion 2210 and/or asecond housing portion 2220 of the electronic device 2200.

The electronic device 2200 may include one or more non-conductivemembers, which are disposed on the first housing portion 2210 and/or thesecond housing portion 2220, respectively. Non-conductive members may bearranged in the first housing portion 2210 and the second housingportion 2220, respectively, and the number of non-conductive membersarranged in the first housing portion 2210 may be the same as, ordifferent from, the number of non-conductive members arranged in thesecond housing portion 2220. Non-conductive members may be symmetricallyor asymmetrically arranged in the first housing portion 2210 and thesecond housing portion 2220, respectively, and the number ofnon-conductive members arranged in the first housing portion 2210 may bethe same as, or different from the number of non-conductive membersarranged in the second housing portion 2220.

For example, one or more first non-conductive members 2215 and 2216 maybe disposed in the first housing portion 2210 and one or more secondnon-conductive members 2225 and 2226 may be disposed in the secondhousing portion 2220. When the electronic device 2200 is folded, thefirst non-conductive members 2215 and 2216 and the second non-conductivemembers 2225 and 2226 disposed in the first and second housing portion2210 and 2220 may be arranged to be aligned to each other in thevertical direction and in the horizontal direction.

The electronic device 2200 may be bent from the first housing portion2210. The first and second housing portions 2210 and 2220 aredifferentiated by the bent portion, and may be understood as onehousing. Accordingly, the first and second housing portions 2210 and2220 are not fixed portions, but may be variously configured dependingon the position of the bent portion in one housing.

The electronic device 2200 may further include a flexible display 2201.The first and second housing portions 2210 and 2220 may be arranged tobe flat or to be bent. The electronic device 2200 may include metalframes, each of which may be arranged in the peripheral rim. First tothird metal frames 2211 to 2213 may be arranged in the edge of the firsthousing portion 2210, and first to third metal frames 2221 to 2223 maybe arranged in the edge of the second housing portion 2220.

The first housing portion 2210 may include the first non-conductivemembers 2215 and 2216, which may be disposed in the first metal frame2211. The second housing portion 2220 may include the secondnon-conductive members 2225 and 2226, which may be disposed in the firstmetal frame 2221. In a state where the electronic device 2200 is bent,the first non-conductive members 2215 and 2216 and the secondnon-conductive members 2225 and 2226 are symmetrically aligned in thevertical direction and in the horizontal direction.

In the state where the first and second housing portions 2210 and 2220are folded, the first and second non-conductive members 2215, 2216,2225, and 2226 may be disposed to be superimposed one on another, whichmay improve an antenna radiation efficiency.

The bent portion of the electronic device 2200 may be formed in apredetermined portion, and may be located at about a 5:5 position, abouta 6:4 position, or about an 7:3 position. For example, the bent portionof the electronic device may be made of a flexible material (e.g., aflexible metal material) or may be provided with a separate foldingunit.

The electronic device 2200 may include one or more non-conductivemembers which may be arranged at various positions of the metal frames.A non-conductive member may be disposed in each of the second metalframes 2212 and 2222 of the first and second housing portions 2210 and2220 or each of the third metal frames 2213 and 2223 of the first andsecond housing portions 2210 and 2220.

The electronic device 2200 may include one non-conductive member, whichis disposed in the first metal frame of each of the housing portions2210 and 2220.

When the first housing portion 2210 and the second housing portion 2220of the electronic device 2200 substantially face each other, the firstnon-conductive member 2215 and 2216 and the second non-conductive member2225 and 2226 are substantially aligned so that antenna radiation may beexecuted through the open region of the antenna formed in the firsthousing portion 2210 and an open region of the second housing portion2220 substantially aligned thereto. Thus, when the antenna radiation isexecuted to the open region of the second housing 2220, thedeterioration of the antenna radiation performance can be prevented.

FIGS. 23A and 23B illustrate an exterior-cover type electronic device,according to an embodiment of the present disclosure.

Referring to FIGS. 23A and 23B, an exterior-cover type electronic device2300 is shown. In FIG. 23A, a perspective view of the electronic device2300 in folded state is provided. In FIG. 23B a perspective view of theelectronic device 2300 in an unfolded state is provided. The electronicdevice 2300, according to various embodiments, may be the same as theelectronic device 101 of FIG. 1.

In FIGS. 23A and 23B, at least a portion of a housing of the electronicdevice 2300 forms at least a portion of an antenna. :For example, atleast one gap may be formed in a first housing portion 2310 and/or asecond housing portion 2320 of the electronic device 2300.

In the electronic device 2300, first non-conductive members 2315 and2316 may be disposed in the first housing portion 2310, and secondnon-conductive members 2325 and 2326 may be disposed in the secondhousing portion 2320. The first non-conductive members 2315 and 2316 ofthe first housing portion 2310 and the second non-conductive members2225 and 2226 of the second housing portion 2320 may be arrangedsymmetrically.

For example, the first non-conductive members 2315 and 2316 may bedisposed in the first metal frame 2311 of the first housing portion 2310and the second non-conductive members 2325 and 2326 may be disposed inthe first metal frame 2321 of the second housing portion 2320, in whichthe first non-conductive members 2315 and 2316 and the secondnon-conductive members 2325 and 2326 may be arranged to be verticallyaligned to each other.

For example, in the state where the electronic device 2300 is folded,the first non-conductive members 2315 and 2316 disposed in the firsthousing portion 2310 may be arranged in the first metal frame 2311symmetrically in the horizontal direction, and the second non-conductivemembers 2325 and 2326 disposed in the second housing portion 2320 may bearranged in the first metal frame 2321 symmetrically in the horizontaldirection.

For example, the non-conductive members disposed in the electronicdevice 2300 may arranged not only in the region of the first metalframes 2311 and 2321 of the first and second housing portions 2310 and2320, but also in each of the second to fourth metal frames of the firstand second housing portions as the same arrangement structures.

The electronic device 2300 may further include an exterior cover 2330.For example, the exterior cover 2330 may physically or electricallyconnect the first and second housing portions 2310 and 2320 to eachother. For example, the exterior cover 2330 includes a connection part2331, which may physically or electrically connect the first and secondhousing portions 2310 and 2320 to each other. According to variousembodiments, the first housing portion 2310 may be a first electronicdevice, and the second housing portion 2320 may be a second electronicdevice.

The exterior cover 2330 may be made of a flexible material (e.g.,leather) to be folded around the connection part 2331. For example, theexterior cover 2330 may be integrated with the first and second housingportions 2310 and 2320, or may be configured to be attachableto/detachable from the first and second housing portions 2310 and 2320.

The electronic device 2300 includes the first housing portion 2310arranged on one inner side with reference to the connection part 2331and the second housing portion 2320 arranged on the other inner side, inwhich the first and second housing portions are capable of being foldedor unfolded.

In the electronic device 2300, first to fourth metal frames 2311 to 2314may be arranged in the edge of the first housing portion 2310, and firstto fourth metal frames 2321 to 2324 may be arranged in the edge of thesecond housing portion 2320.

The first housing portion 2310 may include the first non-conductivemembers 2315 and 2316, which may be disposed in the first metal frame2311. The second housing portion 2320 may include the secondnon-conductive members 2325 and 2326, which may be disposed in the firstmetal frame 2321. In a state where the electronic device 2300 is folded,the first non-conductive members 2315 and 2316 and the secondnon-conductive members 2325 and 2326 are symmetrically aligned in thevertical direction and in the horizontal direction.

When the first and second housing portions 2310 and 2320 are folded, thefirst and second non-conductive members 2315, 2316, 2325, and 2326 maybe disposed to be superimposed on one on another, which may improve anantenna radiation efficiency.

An FPCB may pass through the connection part 2331 of the exterior cover2330.

The arrangement positions of the conductive members (i.e., the metalframes) and non-conductive members 2315, 2316, 2325, and 2326, which arearranged in the first and second housing portions 2310 and 2320 of theelectronic device 2300, may be the same as those of the conductivemembers and the non-conductive members, which are arranged in the firstand second housing portions of the electronic devices, which areillustrated in FIGS. 4A to 5B and FIGS. 9A to 20.

According to various embodiments, when the first face of the firsthousing portion 2310 and the first face of the second housing portion2320 of the electronic device 2300 face each other, the firstnon-conductive member 2315 and 2316 and the second non-conductive member2325 and 2326 are substantially aligned so that antenna radiation may beexecuted through the open region of the antenna formed in the firsthousing portion 2310 and an open region of the second housing portion2320 substantially aligned thereto. Thus, when the antenna radiation isexecuted to the open region of the second housing 2320, thedeterioration of the antenna radiation performance can be prevented.

FIG. 24 illustrates a state in which an electronic device is docked,according to an embodiment of the present disclosure.

Referring to FIG. 24, a first electronic device 2400 and a secondelectronic device 2401 are provided. The electronic devices 2400 and/or2401, according to various embodiments, may be the same as theelectronic device 101 of FIG. 1.

In FIG. 24, the first and second electronic devices 2400 and 2401 arecoupled to each other in a docked state. The second electronic device2401 coupled to the first electronic device 2400 may include a dockingstructure. For example, at least one gap may be formed in a firsthousing portion 2410 of the first electronic device 2400 and/or a secondhousing portion 2420 of the second electronic device 2401.

The electronic devices 2400 and 2401 may include one or morenon-conductive members, which are disposed on the first housing portion2410 of the first electronic device 2400 and/or the second housingportion 2420 of the second electronic device 2401, respectively.Non-conductive members may be arranged in the first housing portion 2410and the second housing portion 2420, respectively, and the number ofnon-conductive members arranged in the first housing portion 2410 may bethe same as, or different from, the number of non-conductive membersarranged in the second housing portion 2420. Non-conductive members maybe symmetrically or asymmetrically arranged in the first housing portion2410 and the second housing portion 2420, respectively, and the numberof non-conductive members arranged in the first housing portion 2410 maybe the same as, or different from the number of non-conductive membersarranged in the second housing portion 2420.

For example, one or more first non-conductive members 2415 and 2416 maybe disposed in the first housing portion 2410 and one or more secondnon-conductive members 2425 and 2426 may be disposed in the secondhousing portion 2420. When the first housing 2410 is docked to thesecond housing portion 2420, the first non-conductive members 2415 and2416 and the second non-conductive members 2425 and 2426 may be arrangedto be aligned to each other in the vertical direction and in thehorizontal direction.

In the electronic device, the first housing portion 2410 of the firstelectronic device 2400 may be coupled to, or mounted on, the secondhousing portion 2420 of the second electronic device 2401 in a dockingmanner. According to various embodiments, the first housing portion 2410may be an electronic device such as a smart phone, and the secondhousing portion 2420 may be a cover, an auxiliary input device, acharging device of the smart phone, a docking station mounted on avehicle, etc. The second housing portion 2420 may be a charging devicemounted on an interior table, desk, etc.

As another example, the first housing portion 2410 and the secondhousing portion 2420 may be separate smart phones, respectively. Forexample, the smart phones may be separately used, and may be used as onesmart phone by being docked to each other. The second housing portion2420 may include various external function devices.

The first housing portion 2410 of the first electronic device 2400 mayinclude first to fourth metal frames 2411 to 2414.

The first housing portion 2410 may include first non-conductive members2415 and 2416, which may be disposed in the first metal frame 2411. Thesecond housing portion 2420 of the second electronic device 2401 mayinclude second non-conductive members 2425 and 2426, which may bedisposed on the facing body. In a state where the electronic devices2400 and 2401 are docked to each other, the first non-conductive members2415 and 2416 and the second non-conductive members 2425 and 2426 aresymmetrically aligned in the vertical direction and in the horizontaldirection. in the state where the first and second housing portions 2410and 2420 are docked to each other, the first and second non-conductivemembers 2415, 2416, 2425, and 2426 may be disposed to be superimposedone on another, which may improve an antenna radiation efficiency of thefirst housing portion.

When the first face of the first housing portion 2410 of the firstelectronic device 2400 and the first face of the second housing portion2420 of the second electronic device 2401 face each other, the firstnon-conductive members 2415 and 2416 and the second non-conductivemembers 2425 and 2426 are substantially aligned so that antennaradiation may be executed through the open region of the antenna formedin the first housing portion 2410 and an open region of the secondhousing portion 2420 substantially aligned thereto. Thus, when theantenna radiation is executed to the open region of the second housing2420, the deterioration of the antenna radiation performance can beprevented.

In the electronic device 2400, one or more non-conductive member may bedisposed in the first housing portion and one or more non-conductivemember may be disposed in the second housing portion, in which, in thestate where the electronic device is docked, the non-conductive membersof the first and second housing portions 2410 and 2420 may be aligned toeach other. For example, three or more non-conductive members may bedisposed in each of the first and second housing portions 2410 and 2420.

According to various embodiments of the present disclosure, anelectronic device may include: a housing including a first housingportion that includes a first face, a second face that faces opposite tothe first face, and a first side face that encloses at least a portionof a space between the first face and the second face, and furtherincluding a second housing portion that includes a first face orientedto face the first face of the first housing portion, a second face thatfaces opposite to the first face, and a second side face that enclosesat least a portion of a space between the first face and the secondface; a connection part that interconnects the first housing portion andthe second housing portion; a communication circuit disposed within thehousing; a first conductive member extending along at least a portion ofthe first side face, and including at least one gap configured toelectrically separate portions of the first conductive member; a firstnon-conductive member configured to fill at least a portion of the atleast one gap of the first conductive member; a second conductive memberextending along at least a portion of the second side face, andincluding at least one gap configured to electrically separate portionsof the second conductive member; and a second non-conductive memberconfigured to fill at least a portion of the at least one gap of thesecond conductive member, wherein, in a state where the first face ofthe second housing portion faces the first face of the first housingportion, the first non-conductive member and the second non-conductivemember are substantially aligned to each other when viewed from the sideface of the first or second housing portion.

The first conductive member may be electrically connected to thecommunication circuit.

The electronic device may further include a ground member positionedwithin the housing, the second conductive member may be electricallyconnected to the ground member.

The second conductive member may not be electrically connected to thecommunication circuit.

The first non-conductive member may include a metallic material, and thesecond conductive member may include a material that is the same as themetallic material of the first non-conductive member.

The metallic material may include at least one of aluminum, stainlesssteel, and amorphous metal alloy.

The first conductive member may include two gaps that are spaced apartfrom each other along at least a portion of the first side face toelectrically separate portions of the first conductive member from eachother, the first non-conductive member fills at least one of the twogaps, and the electronic device further may include a thirdnon-conductive member that fills at least a portion of another one ofthe two gaps.

The second conductive member may include two gaps that are spaced apartfrom each other along at least a portion of the second side face toelectrically separate portions of the second conductive member from eachother, the second non-conductive member may fill at least one of the twogaps, and the electronic device may further include a fourthnon-conductive member that fills at least a portion of another one ofthe two gaps.

In a state where the first face of the second housing portion faces thefirst face of the first housing portion, the third non-conductive memberand the fourth non-conductive member may be substantially aligned toeach other when viewed from the side face of the first or second housingportion.

Each of the first non-conductive member and the second non-conductivemember may include one non-conductive member or a pair of non-conductivemembers spaced apart from each other, the one non-conductive member orthe pair of non-conductive members being disposed on the first side faceor the second side face.

The first non-conductive member and the second non-conductive member mayinclude one non-conductive member disposed on the first side face or thesecond side face, and the other of the first non-conductive member andthe second non-conductive member includes a pair of non-conductivemembers that are spaced apart from each other and disposed on the secondside face or the first side face. In a state where the first face of thesecond housing portion faces the first face of the first housingportion, one of the pair of non-conductive members may be aligned to theone non-conductive member when viewed from the side face of the first orsecond housing portion.

The connection part may include a shaft configured to provide a pivotmovement such that the first and second housing portions are folded toor unfolded from each other.

The connection part may include a connection structure configured toconnect the first and second housing portions such that the first andsecond housing portions are slid in a direction parallel to the first orsecond face of the first housing in a state where the first and secondhousings at least partially face each other.

According to various embodiments, an electronic device may include: afirst electronic device including a first side face; and a secondelectronic device connected to the first electronic device to bedetachable/attachable or by using a connection device, and including asecond side face that is at least partially aligned to the first sideface when the second electronic device is connected to the firstelectronic device. The first electronic device may include: a firstconductive rim structure that encloses at least a portion of the firstside face and includes at least one first gap, and a first insulationportion that fills the at least one first gap to electrically separateportions of the first conductive rim structure. The second electronicdevice may include: a second conductive rim structure that encloses atleast a portion of the second side face and includes at least one secondgap, and a second insulation portion that fills the at least one secondgap to electrically separate portions of the second conductive rimstructure.

The first conductive rim structure may include one first gap or a pairof first gaps, and the second conductive rim structure may include onesecond gap or a pair of second gap.

The first conductive rim structure may have a substantially rectangularshape including a first side, a second side that is shorter than thefirst side, a third side that has a length that is equal to that of thefirst side, and a fourth side that has a length that is equal to thesecond side, and the at least one first gap is included in the secondside.

The second conductive rim structure may have a substantially rectangularshape that includes a first side, a second side shorter than the firstside, a third side that has a length that is equal to that of the firstside, and a fourth side that has a length that is equal to that of thesecond side, and when the first and second electronic devices areconnected to each other such that the first side face and the secondside face are at least partially aligned to each other, the first tofourth sides are positioned to be adjacent to the first to fourth sidesof the first conductive rim structure, respectively, and the at leastone second gap may be included in the second side of the secondconductive rime structure.

The first electronic device may further include a communication circuitelectrically connected to a partial region of the first conductive rimstructure.

At least one of the first and second electronic devices may furtherinclude a ground member positioned within the housing, and at least oneof the first and second conductive rim structures may be electricallyconnected to the ground member.

At least one of the first electronic device and the second electronicdevice may include a display device, a processor that is electricallyconnected to the display device and the communication circuit, and amemory electrically connected to the processor. The memory may storeinstructions which, when executed, cause the processor to receive awireless signal through the communication circuit by using at least aportion of the first conductive rim structure as an antenna, and tocause the processor to display at least one item on the display device,based on at least a portion of the received signal.

According to various embodiments of the present disclosure, a portableelectronic device may include: a first electronic device portionincluding a first housing; and a second electronic device portionincluding a second housing connected to a portion of the first housingand folded to at least partially overlap with the first housing. Thefirst housing may include a first side face, and the second housing mayinclude a second side face that is aligned to the first side face whenthe second housing is folded to overlap with the first housing. Thefirst side face of the first electronic device may include a first metalportion, a second metal portion electrically spaced apart from the firstmetal portion, and a first non-metal portion that fills a gap betweenthe first metal portion and the second metal portion. The second sideface of the second electronic device may include a third metal portion,a fourth metal portion electrically spaced apart from the third metalportion, and a second non-metal portion that fills a gap between thethird metal portion and the fourth metal portion. The first non-metalportion and the second non-metal portion may be aligned to each otherwhen the second housing is folded to overlap with the first housing.

The first side face of the first electronic device may include a fifthmetal portion that is electrically spaced apart from the second metalportion, and a third non-metal portion that fills a gap between thesecond metal portion and the fifth metal portion. The second side faceof the second electronic device may include a sixth metal portion thatis electrically spaced apart from the fourth metal portion, and a fourthnon-metal portion that fills a gap between the fourth metal portion andthe sixth metal portion. The third non-metal portion and the fourthnon-metal portion may be aligned to each other when the second housingis folded to overlap with the first housing.

According to various embodiments of the present disclosure, anelectronic device may include: a foldable, slidable, or combinablehousing including a first housing portion that includes a first face, asecond face that faces opposite to the first face, and a side face thatencloses at least a portion of a space between the first face and thesecond face and further including a second housing portion that includesa first face that faces the first face of the first housing portion whenthe second housing portion is folded, slid, or combined to overlap withthe first housing portion, a second face that faces opposite to thefirst face, and a side face that encloses at least a portion of a spacebetween the first face and the second face; a connection part thatinterconnects the first housing portion and the second housing portion;a communication circuit disposed within the housing; a first conductivemember configured to form a portion of the side face of the firsthousing portion, and electrically connected to the communicationcircuit; a first non-conductive member configured to form anotherportion of the side face of the first housing, and to be in contact withthe first conductive member so as to electrically separate the firstconductive member from another portion of the side face of the firsthousing portion; a second conductive member configured to form a portionof the side face of the second housing portion; and a secondnon-conductive member configured to form another portion of the sideface of the second housing, and to be in contact with the secondconductive member so as to electrically separate the second conductivemember from another portion of the side face of the second housingportion. When the first and second housing portions are folded, slid, orcombined to overlap, the first non-conductive member and the secondnon-conductive member may be substantially aligned to each other whenviewed from the side face of the first or second housing portion.

Each of the elements described in the present document may be configuredwith one or more components, and the names of the corresponding elementsmay vary based on the type of the electronic device 100. According tovarious embodiments, the electronic device 100 may include at least oneof the elements described in the present document. Some elements may beomitted or other additional elements may be further included in theelectronic device. Also, some of the elements of the electronic device100 may be combined into one entity, which may perform functionsidentical to those of the corresponding elements before the combination.

While the disclosure has been shown and described with reference tovarious embodiments described herein, it will be understood by thoseskilled in the art that various changes in form and detail may be madetherein without departing from the spirit and scope of the disclosure asdefined, not by the detailed description and embodiments, but by theappended claims and their equivalents.

What is claimed is:
 1. A foldable electronic device comprising: aflexible display; and a foldable housing accommodating the flexibledisplay, the foldable housing including: a first housing part having twoopposite sides, the first housing part including a first edge portion,the first edge portion including two conductive portions and a firstnon-conductive portion disposed between the two conductive portions ofthe first edge portion, and a second housing part having two oppositesides, the second housing part including a second edge portion, thesecond edge portion including two conductive portions and a secondnon-conductive portion disposed between the two conductive portions ofthe second edge portion, wherein the foldable housing is configured suchthat the first non-conductive portion and the second non-conductiveportion are disposed to be in alignment with each other when thefoldable housing is fully folded, wherein a first conductive portion ofthe two conductive portions of the first edge portion is electricallyconnected to communication circuitry such that a radio frequencycommunication signal is transmitted or received via the first conductiveportion of the first edge portion, and wherein a first portion of theflexible display is accommodated in the first housing part, and a secondportion of the flexible display is accommodated in the second housingpart.
 2. The foldable electronic device of claim 1, wherein the twoconductive portions of the first edge portion and the two conductiveportions of the second edge portion are symmetrically arranged.
 3. Thefoldable electronic device of claim 1, wherein the foldable housing isconfigured such that the first non-conductive portion and the secondnon-conductive portion are disposed adjacent to each other when thefoldable housing is fully folded.
 4. The foldable electronic device ofclaim 1, further comprising a ground unit within the foldable housing,wherein the ground unit is electrically connected to at least oneconductive portion of the two conductive portions of the second edgeportion.
 5. The foldable electronic device of claim 4, furthercomprising an additional ground unit, wherein the additional ground unitis electrically connected to a second conductive portion of the twoconductive portions of the first edge portion.
 6. The foldableelectronic device of claim 1, wherein a power feed is configured tosupply power to the first conductive portion of the first edge portion.7. The foldable electronic device of claim 6, wherein the firstconductive portion is configured to operate as an antenna radiator. 8.The foldable electronic device of claim 7, wherein, when the foldablehousing is fully folded, radiation radiated from the antenna radiator isradiated through the first non-conductive portion and the secondnon-conductive portion in alignment with each other.
 9. The foldableelectronic device of claim 1, wherein the two conductive portions of thefirst edge portion include a metallic material and the two conductiveportions of the second edge portion include the same metallic material.10. The foldable electronic device of claim 9, wherein the metallicmaterial is one of aluminum, stainless steel, and amorphous metal alloy.11. The foldable electronic device of claim 1, wherein the foldablehousing further comprises a hinge configured to provide an axis aroundwhich the first housing part and the second housing part fold andunfold.
 12. The foldable electronic device of claim 11, wherein a firstlength of the first housing part is the same as a second length of thesecond housing part, and wherein each direction of the first length andthe second length is perpendicular to the axis of the hinge.
 13. Thefoldable electronic device of claim 11, wherein a first length of thefirst housing part is different from a second length of the secondhousing part, and wherein each direction of the first length and thesecond length is perpendicular to the axis of the hinge.
 14. Thefoldable electronic device of claim 1, wherein the foldable housingcomprises a bent portion formed of a flexible material.
 15. The foldableelectronic device of claim 1, wherein both the first portion and thesecond portion of the foldable display are configured to displaycontents when the foldable housing is unfolded.
 16. The foldableelectronic device of claim 1, wherein first content displayed on thefirst portion of the foldable display is different from second contentdisplayed on the second portion of the foldable display when thefoldable housing is unfolded.